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NB100LVEP91DWG is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists onsemi. Its product description is IC TRANSLATOR UNIDIR 20SOIC. Review the specifications below when checking this part for your BOM.
The NB100LVEP91DWG is a triple-channel level translator manufactured by onsemi, designed to convert various single-ended or differential input signals into negative ECL (NECL) outputs. It accepts inputs from LVPECL, LVTTL, LVCMOS, HSTL, CML, and LVDS standards. The device operates with a positive supply voltage (VCC) ranging from 2.375 V to 3.8 V and requires a negative supply (VEE) for NECL generation. It features a propagation delay of 675 ps and functions within an operating temperature range of -40°C to +85°C. The component is housed in a 20-pin SOIC-Wide package.
Verify the specific suffix DWG corresponds to the SOIC-Wide-20 tube packaging configuration when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure power supply decoupling capacitors are placed close to VCC and VEE pins as specified in the datasheet to maintain signal integrity and stability during operation.
Select this component when interfacing mixed-signal environments where LVPECL, LVCMOS, or LVDS sources must drive NECL loads. The wide input compatibility eliminates the need for multiple specialized translators. Consider the 675 ps propagation delay and 20-pin package constraints relative to board space and timing requirements compared to faster QFN alternatives like the MNG variant.
This part belongs to the NB100LVEP91 series of level translators from onsemi. It shares functional similarities with the MC100EP91 but differs in package type and specific electrical characteristics. The DWG suffix denotes the plastic small-outline wide package variant, distinct from the QFN MNG version which offers similar functionality in a smaller footprint.
NB100LVEP91MNG serves as a direct functional alternative with identical electrical performance but utilizes a QFN-24 package instead of SOIC-Wide-20. Designers must verify pinout compatibility and thermal management requirements when substituting between these package types.
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