NB2308AI2DTG

Overview

The NB2308AI2DTG is a 3.3 V zero delay clock buffer from onsemi, designed for high-speed clock distribution in industrial environments. It features an internal PLL that locks to a reference input on the REF pin, with feedback provided via the FBK pin. The device offers eight buffered outputs organized into two banks of four (Bank A and Bank B), controllable via S1 and S2 select inputs. Key electrical specifications include an input-to-output propagation delay under 250 ps, output-to-output skew less than 200 ps, and cycle-to-cycle jitter below 200 ps at 66.67 MHz. It supports frequencies from 15 MHz to 133 MHz and operates within a temperature range of -40°C to +85°C.

Feature Summary

• Zero delay buffer with adjustable input-to-output propagation delay via capacitive load on the FBK pin.
• Configurable frequency multiplication: NB2308A*2 variant provides 2X frequency on Bank A when feedback is sourced from Bank B.
• Low skew performance: Output-to-output skew < 200 ps; Device-to-device skew < 700 ps.
• Dual-bank architecture with three-state capability controlled by S1 and S2 select inputs.

Applications

• High-speed clock distribution in industrial data acquisition systems.
• Synchronization of multiple peripherals requiring low-skew clock signals.
• System testing modes where direct input clock application to outputs is required.

Procurement Notes

Verify the ordering suffix 'DTG' corresponds to the TSSOP-16 package (CASE 948F) and Pb-Free status as per the datasheet's Ordering Information table. Confirm the 'I' designation indicates Industrial temperature range (-40°C to +85°C). Ensure the second digit '2' matches the required NB2308A*2 configuration for 2X/1X frequency options. Cross-reference the specific revision (Rev. 2) if legacy documentation compatibility is critical.

Selection Notes

Select the NB2308AI2DTG when a 2X frequency multiplier is needed on Bank A outputs while maintaining Reference frequency on Bank B, configured by feeding back from Bank B. Choose this over the *1 or *1H variants if frequency multiplication is required. Ensure load capacitance is managed (15 pF for >100 MHz, 30 pF for <100 MHz) to maintain specified rise/fall times and skew parameters. Verify that the TSSOP-16 package fits the PCB footprint constraints compared to the SOIC-16 option.

Part Context

The NB2308A series comprises five base configurations (*1 through *5H) offering various frequency division/multiplication options. The 'I' suffix denotes Industrial grade operation, while 'C' denotes Commercial grade. The 'D' suffix indicates SOIC-16 packaging, whereas 'DT' indicates TSSOP-16. The 'G' suffix signifies a Pb-Free package. This specific part combines the Industrial rating, *2 configuration, TSSOP-16 package, and Pb-Free compliance.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided datasheet. Direct replacements must match the NB2308A*2 functional configuration, 3.3V supply, and TSSOP-16 package. Verify that any alternative device supports the same 2X frequency multiplication logic when feedback is derived from Bank B outputs.