NB2309AI1DTG

Overview

The NB2309AI1DTG is a 3.3 V zero delay clock buffer manufactured by onsemi, designed for distributing high-speed clocks in industrial and commercial environments. It accepts one reference input and drives nine low-skew outputs using an internal PLL locked to the REF pin. The device operates within a frequency range of 15 MHz to 133 MHz with a supply voltage of 3.0 V to 3.6 V. It features less than 250 ps output-to-output skew and less than 700 ps device-to-device skew. The component is housed in a 16-pin TSSOP package (CASE 948F) and supports cycle-to-cycle jitter of less than 200 ps.

Feature Summary

• Zero Input-Output Propagation Delay via internal PLL feedback
• One input drives nine outputs grouped as 4 + 4 + 1
• Output-to-output skew guaranteed less than 250 ps
• Test mode allows bypassing the PLL for direct input application

Applications

• CPU and PCI Bus frequency distribution
• Pentium/C0082 based systems requiring low jitter
• Multi-device clock distribution networks

Procurement Notes

Verify the ordering suffix 'DT' corresponds to the TSSOP-16 package configuration. Confirm that the specific revision matches the May 2015 Rev. 11 datasheet requirements. Ensure compatibility with the 3.3 V supply voltage and check if the standard -1 drive strength meets load capacitance requirements for frequencies up to 133 MHz.

Selection Notes

Select this part when a single reference clock must be distributed to nine loads with minimal skew. The NB2309AI1DTG provides a TSSOP-16 footprint alternative to the SOIC-16 version. Note that the CLKOUT pin requires equal loading to other outputs to maintain zero input-output delay characteristics. Verify that the 350 ps maximum propagation delay fits the system timing constraints.

Part Context

This component belongs to the NB2309A family of 3.3 V zero delay buffers. The NB2309AI1DTG specifically denotes the Industrial/Commercial temperature rated version (-1) packaged in a TSSOP-16 format. It shares functional block diagrams with the NB2309AI1DG (SOIC-16) variant but differs in physical dimensions and thermal properties associated with the thin-shrink small-outline package.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.