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NCN6001DTBR2G is listed in the Specialized range at ChipApex. The manufacturer field lists onsemi. Its product description is IC INTERFACE SPECIALIZED 20TSSOP. Review the specifications below when checking this part for your BOM.
The NCN6001DTBR2G is a mixed-signal integrated circuit designed for smart card interface applications, manufactured by onsemi. It facilitates communication between smart cards and microcontrollers while adhering to ISO7816 and EMV electrical specifications. The device operates within a supply voltage range of 2.7 V to 5.5 V and consumes a maximum operating current of 35 µA. It supports SPI interface connectivity and functions reliably across an operating temperature range from -25 °C to +85 °C. The component features a power dissipation rating of 320 mW and is housed in a 20-TSSOP surface-mount package with a width of 4.40 mm.
Verify component authenticity through authorized channels as the part status is End-of-Life. Confirm RoHS compliance and REACH status prior to integration. Check for alternative sources or compatible replacements due to discontinuation. Ensure storage conditions meet moisture sensitivity level requirements. Validate supplier documentation against official datasheets.
Select this component for designs requiring compliant smart card interfacing with low power consumption. Consider the 20-TSSOP package constraints for PCB layout. Evaluate thermal performance given the 320 mW dissipation limit. Verify voltage compatibility with the target microcontroller system. Assess availability challenges due to the discontinued status.
The NCN6001 series serves as a specialized interface solution for connecting smart cards to host controllers. This specific variant includes tape-and-reel packaging options suitable for automated assembly processes. It belongs to a family of components focused on secure data exchange in financial and identification applications.
Publicly confirmed substitute part numbers are not available in the provided source material. Due to the End-of-Life status, design teams should consult manufacturer announcements for lifecycle management guidance or identify functionally equivalent alternatives through independent technical comparison.
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