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NCP4682HMU33TCG is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists onsemi. Its product description is IC REG LINEAR 3.3V 150MA 4-UDFN. Review the specifications below when checking this part for your BOM.
The NCP4682HMU33TCG is a fixed-output linear voltage regulator from onsemi, providing a nominal 3.3 V output with a maximum continuous current of 150 mA. It operates within an input voltage range of 1.70 V to 5.25 V and features ultra-low supply current of 1.0 µA. The device includes a Chip Enable (CE) function for power management, achieving a standby current of 0.1 µA. Output voltage accuracy is ±0.8% at 25°C. Integrated protections include current fold-back for overcurrent conditions. The component is housed in a 4-UDFN package measuring 1.0 x 1.0 mm.
Verify the specific ordering suffix HMU33TCG to confirm the UDFN4 package, 3.3 V fixed output, and high-level enable functionality. Confirm RoHS compliance status as indicated by the TCG suffix. Check manufacturer documentation for End-of-Life notifications or Product Change Notices that may affect availability or specifications.
Select this component when low static current consumption is critical for extending battery life. The integrated enable feature allows system-level power gating. Ensure the application requires a fixed 3.3 V rail and does not exceed the 150 mA output limit. Verify thermal requirements for the UDFN4 package based on PCB layout and ambient temperature conditions.
This part belongs to the NCP4682 series of CMOS Low Dropout Linear Voltage Regulators. It is distinct from the NCP4685, which lacks the Chip Enable function. The H-series designation indicates the inclusion of the enable pin, while the M-series denotes the specific UDFN4 package configuration.
Direct functional equivalents within the same family include NCP4682DMU33TCG, which offers auto-discharge capabilities instead of simple enable control. Other package variants such as SOT-23-5 or SC-82AB exist but require footprint modifications.
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