— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IMVP9.1 CONTROLLER
- Series:-
- Mfr:onsemi
- Package:Tape & Reel (TR),Cut Tape (CT)
- Applications:Controller, CPU
- Voltage - Input:4.5V ~ 21V
- Number of Outputs:4
- Voltage - Output:Programmable
- Operating Temperature:-40°C ~ 100°C (TA)
- Mounting Type:Surface Mount
- Package / Case:52-VFQFN Exposed Pad
- Supplier Device Package:52-QFN (6x6)
- Grade:-
- Qualification:-
Download product information
Overview
The NCP81523MNTXG is a switching controller from onsemi, belonging to the NCP81523 series. It is classified under PMIC - Power Management ICs and specifically designed as an IMVP9.1 controller. The device utilizes a QFN package and operates within an industrial temperature range. It supports Reel and Cut Tape packaging formats with a factory pack quantity of 2500 units. This component functions as a multi-phase step-down controller optimized for high-performance computing applications requiring precise voltage regulation.
Feature Summary
- Implements IMVP9.1 protocol compliance for advanced processor power management
- Provides multi-phase step-down control architecture
- Features integrated gate driver capabilities for external MOSFETs
Applications
- Intel Core processor core voltage regulation
- High-density server power supply designs
- Workstation graphics processing unit power stages
Procurement Notes
Verify the exact suffix against official datasheets to confirm pinout and thermal pad configurations. Confirm availability status directly with authorized distributors as stock levels fluctuate. Ensure ESD handling procedures are followed during assembly due to the sensitive nature of the CMOS control logic. Cross-reference the specific revision level to guarantee compatibility with existing PCB layouts and firmware requirements.
Selection Notes
Select this controller when designing systems that strictly adhere to Intel's IMVP9.1 specifications for dynamic voltage scaling. It is suitable for applications requiring multiple output phases to distribute thermal load efficiently. Consider the QFN package constraints for thermal dissipation in compact form factors. Evaluate the need for external compensation components based on the specific loop stability requirements of the target load transient response.
Part Context
This component is part of onsemi's portfolio dedicated to high-performance computing power solutions. It complements other devices in the NCP815xx family, which cater to various Intel VRM standards. The series focuses on delivering efficient, stable power delivery for complex digital loads found in modern CPUs and GPUs.
FAQ
What power management standard does this controller support?
It is designed to comply with the Intel Mobile Voltage Positioning (IMVP) 9.1 specification.
Is this device a complete regulator or a controller?
It is a switching controller that requires external power stage components such as MOSFETs and inductors to function.
ChipApex | Global Electronic Components Supplier








