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NCV20084DTBR2G is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists onsemi. Its product description is IC OPAMP GP 4 CIRCUIT 14TSSOP. Review the specifications below when checking this part for your BOM.
The NCV20084DTBR2G is a quad operational amplifier from onsemi, designed for general-purpose applications. It features a gain-bandwidth product of 1.2 MHz and a slew rate of 400 mV/µs. The device operates with an input offset voltage of 500 µV and supports a supply voltage range up to 5.5 V. It offers rail-to-rail output capability and is qualified under AEC-Q100 standards for automotive use. The component functions within a temperature range of -40°C to +125°C and is housed in a 14-TSSOP package.
Verify the specific ordering suffix and tape-and-reel packaging details against the manufacturer's latest datasheet before procurement. Confirm that the AEC-Q100 automotive qualification status aligns with your project requirements. Ensure the 14-TSSOP footprint matches your PCB design constraints. Cross-reference the part number with official distributor catalogs to confirm current availability and authenticity.
Select this component when a quad amplifier with rail-to-rail output is required in a compact surface-mount package. It is suitable for designs needing moderate bandwidth and low offset voltage. Consider the 5.5 V maximum supply limit and the -40°C to +125°C operating range. Verify compatibility with existing control logic levels due to the output swing characteristics.
This part belongs to onsemi's NCV series, which focuses on automotive-grade electronic components. The NCV20084 provides a quad-channel solution within this lineup, offering a balance of performance and reliability for vehicle electronics. It complements other analog signal processing devices in the portfolio by addressing multi-channel sensing needs.
Check for direct pin-compatible alternatives within the same family or from other manufacturers. Ensure replacement parts meet the same AEC-Q100 qualification and electrical specifications. Verify package dimensions and thermal characteristics to maintain board integrity.
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