NCV7462DQ1R2G

NCV7462DQ1R2G

$5.71
  • Description:IC SYST BASIS CHIP 36SSOP
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:adc681909c88 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SYST BASIS CHIP 36SSOP
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Series:-
  • Mfr:onsemi
  • Type:System Basis Chip (SBC)
  • Applications:CAN
  • Mounting Type:Surface Mount
  • Package / Case:36-BFSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package:36-SSOP-EP
  • Grade:Automotive
  • Qualification:AEC-Q100

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NCV7462DQ1R2G

Overview

The NCV7462DQ1R2G is an automotive-grade System Basis Chip (SBC) from onsemi, designed for CAN bus applications. It integrates a LIN transceiver and a 250mA LDO regulator within a single package. The device operates in the -40°C to +150°C junction temperature range, ensuring reliability in harsh automotive environments. It is qualified to AEC-Q100 standards and housed in a 36-BFSOP (SSOP-EP) exposed pad package with dimensions of 0.295 inches (7.50mm) width. This component serves as a central interface for body control modules, combining power management and communication capabilities.

Feature Summary

  • Integrated LIN transceiver for local area network communication
  • Built-in 250mA low-dropout (LDO) voltage regulator
  • AEC-Q100 qualified for automotive grade reliability
  • Extended operating junction temperature range up to +150°C

Applications

  • Body Control Modules (BCM)
  • Central Electronic Modules
  • Door Control Units
  • Seat Control Systems

Procurement Notes

Verify the specific ordering suffix DQ1R2G against official onsemi documentation to confirm tape and reel packaging quantities and lot traceability requirements. Ensure compatibility with surface mount assembly processes for the 36-BFSOP exposed pad package. Confirm that the AEC-Q100 qualification status meets the specific project's reliability standards before finalizing procurement orders.

Selection Notes

Select this SBC when a combined solution for LIN communication and regulated power supply is required for automotive body electronics. The 250mA LDO output must be sufficient for the target load current. Consider the 36-pin BFSOP package constraints for PCB layout, particularly regarding thermal dissipation through the exposed pad. Verify that the CAN interface requirements align with the specific system basis chip variant, as descriptions may vary by sub-model.

Part Context

This component belongs to onsemi's portfolio of specialized ICs for automotive systems. It functions as a System Basis Chip, integrating multiple discrete functions into a single package to reduce board space and complexity. The NCV prefix indicates its automotive grade designation, distinguishing it from commercial variants. It is part of a family of solutions designed to meet the stringent demands of modern vehicle electronic architectures.

Replacement Considerations

Check for direct pin-to-pin compatible alternatives within the onsemi NCV74xx series or other manufacturers' automotive SBCs. Verify that any substitute maintains the same 36-BFSOP package outline and electrical characteristics, including the 250mA LDO output and LIN transceiver specifications. Ensure the replacement also holds AEC-Q100 qualification if required by the design.

NCV7462DQ1R2GNCV7462DQ1R2G
$5.71
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