NCV7704DQR2G

NCV7704DQR2G

$2.07
  • Description:MOD MIRROR-MOD DVR 36SSOP
  • Series:-
  • Mfr:onsemi
  • Package:Tape & Reel (TR)

SKU:32fa13c8474e Category: Brand:

  
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Product Detailed Parameters

  • Description:MOD MIRROR-MOD DVR 36SSOP
  • Series:-
  • Mfr:onsemi
  • Package:Tape & Reel (TR)
  • Applications:-
  • Current - Supply:7.5mA
  • Voltage - Supply:5.5V ~ 28V
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:36-BFSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package:36-SSOP-EP
  • Grade:Automotive
  • Qualification:AEC-Q100

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NCV7704DQR2G

Overview

The NCV7704DQR2G is a mirror-module driver IC manufactured by onsemi, designed for automotive body control systems. It integrates drivers to control front door loads including mirror positioning, heating, and folding functions. The device features an SSOP-36 EP package with 36 pins. It operates within a supply voltage range of 3.15 V to 5.25 V. The component supports a maximum operating temperature of +150 °C and a minimum of -40 °C. It is AEC-Q100 qualified for automotive reliability.

Feature Summary

  • Integrates dedicated drivers for mirror positioning, heating, and folding mechanisms
  • Designed specifically for automotive front door module applications
  • AEC-Q100 qualified for automotive grade reliability

Applications

  • Automotive side-view mirror positioning control
  • Mirror heating element driver circuits
  • Mirror folding mechanism actuation
  • Front door body control system integration

Procurement Notes

Verify the specific suffix (DQR2G) against the official datasheet to confirm package type and reel specifications. Confirm AEC-Q100 qualification status if required for your specific automotive application tier. Check for any recent product change notices or end-of-life announcements from onsemi prior to final design-in decisions.

Selection Notes

Select this component when designing integrated mirror modules requiring combined control for positioning, heating, and folding in a single package. Ensure the PCB layout accommodates the SSOP-36 EP footprint. Verify that the thermal management strategy supports the +150 °C junction temperature capability inherent to the automotive-grade silicon process.

Part Context

This part belongs to onsemi's portfolio of specialized power management ICs for automotive body electronics. It consolidates multiple discrete driver functions into a single solution, reducing bill of materials count and board space compared to using separate controllers and drivers for each mirror function.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Consult onsemi technical support for direct pin-to-pin replacements or functional equivalents within the NCV77xx series.

NCV7704DQR2GNCV7704DQR2G
$2.07
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