SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The NCV7708BDWR2G is an automotive-grade double hex driver manufactured by onsemi. It integrates six half-bridge drivers within a single package, designed for controlling multiple loads such as solenoids, lamps, or small motors in vehicle applications. The device features a wide supply voltage range of 3.15V to 5.25V for logic and supports load voltages from 5.5V up to 28V. It delivers a continuous output current of 0.5A per channel with peak capabilities exceeding standard ratings. Operating reliably across an extended temperature range from -40°C to +150°C TJ, it ensures robust performance in harsh automotive environments while maintaining low standby current consumption.
Verify the specific suffix BDWR2G matches the required thermal and packaging specifications for your assembly process. Confirm that the AEC-Q100 qualification status aligns with your automotive reliability standards. Ensure the SOIC-28 package dimensions are compatible with your PCB footprint and reflow profile requirements before finalizing procurement orders.
Select this component when designing systems requiring multiple isolated half-bridge outputs in a compact form factor. It is suitable for applications needing precise current control up to 0.5A per channel. Consider its integrated protection features if space for external protection components is limited. Evaluate the 28-SOIC package size against available board real estate constraints.
This part belongs to the NCV7708 family of double hex drivers from onsemi, specifically tailored for automotive body applications. The 'B' variant typically denotes specific electrical characteristics or pinout configurations within the series. It complements other variants like the NCV7708ADWR2G which may offer different current ratings or feature sets for varied load requirements.
Direct substitutes include NCV7708ADWR2G and NCV7708DW. Verify functional equivalence regarding output current ratings and protection thresholds. Check for pin-to-pin compatibility and identical package dimensions to ensure seamless integration without PCB redesign.