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The NCV7708FDQR2G is an automotive-grade double hex half-bridge driver manufactured by onsemi. It integrates six independent half-bridge outputs, each capable of delivering a continuous output current of 500 mA. The device operates within a supply voltage range of 3 V to 5.25 V and supports load voltages up to 40 V. It features a serial peripheral interface (SPI) for control and diagnostics. The component is qualified to AEC-Q100 standards and functions reliably across a junction temperature range of -40 °C to +150 °C. It is housed in a 28-pin SOIC package.
Verify the specific suffix FDQR2G against official datasheets to confirm pinout and electrical characteristics match design requirements. Ensure compatibility with existing PCB footprints and thermal management strategies. Confirm that the selected packaging format aligns with assembly line capabilities. Cross-reference the latest revision history for any functional updates or recommended layout changes before finalizing procurement.
Select this component when designing systems requiring multiple isolated low-current switching channels controlled digitally. The integrated half-bridge topology simplifies board space compared to discrete solutions. Consider the 500 mA per channel limit for load sizing. The wide operating temperature range makes it suitable for under-hood or exterior automotive modules where thermal stress is significant.
This part belongs to the NCV7708 family of double hex drivers from onsemi. Variants such as NCV7708CDWR2G and NCV7708BDWR2G exist within the same series, often differing in packaging or specific automotive qualification grades. The NCV7708 series is designed to replace older discrete driver solutions, offering higher integration and reduced bill of materials for complex motor and load control architectures.
Direct substitutes include other NCV7708 variants like NCV7708CDWR2G if package compatibility allows. Verify pin-to-pin equivalence and electrical ratings before substitution. Generic half-bridge drivers may require additional external components and do not offer the same level of integrated diagnostic functionality.