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NCX8200UKZ is listed in the Audio Special Purpose range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC AUDIO SWITCH 9WLCSP. Review the specifications below when checking this part for your BOM.
The NCX8200UKZ is an audio jack configuration switch matrix designed to support 3- and 4-pole connectors. It allows reconfiguration of GND and microphone-bias contacts to comply with AHJ (Apple Headset Jack) and OMTP (Original Mobile Telecommunications Platform) pinouts. The device features a GND sense path for quasi-differential amplifier architectures, Human Body Model (HBM) compliant ESD protection rated at 8 kV, and operates from a 1.6 V to 3.6 V supply. It offers low quiescent current (0.1 µA typ), ultra-low RDSon switches, and high power supply ripple rejection. Packaged in a space-saving 9-WLCSP (1.22x1.22 mm) format, it ensures low Total Harmonic Distortion (THD) and noise in the microphone pass-through channel.
Verify the specific ordering suffix UKZ against the manufacturer's latest documentation to confirm package type and marking codes. Ensure design compliance with the recommended operating conditions, specifically the 1.6 V to 3.6 V supply range and -40°C to +85°C temperature limits.
Select this component when AHJ or OMTP standard compliance is required for audio jack interfaces. The internal 750 kΩ pull-down resistor on the SEL pin defaults to AHJ configuration if left unconnected. Designers must place a bypass capacitor of at least 1 µF close to the VDD pin for stable operation.
The NCX8200UKZ belongs to NXP's audio special purpose IC family, specifically designed as a switch matrix for mobile audio interfaces. It replaces discrete switching solutions by integrating multiple analog switches into a single WLCSP9 package, reducing PCB footprint and simplifying layout for consumer audio applications.
No direct public substitutes are documented in the provided source material.
The device uses the SEL pin to select the configuration. A low level on SEL connects CON1 to GND and routes MIC to CON2 (AHJ). A high level connects CON2 to GND and routes MIC to CON1 (OMTP).
An internal 750 kΩ pull-down resistor sets the SEL pin to a low level by default, configuring the device for AHJ compliance when no external voltage is applied.
The maximum continuous current from CON1 or CON2 to GND is 100 mA. The maximum continuous current from MIC to CON1 or CON2 is 50 mA.
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