Memory IC NDB16PFC-4DET TR product image

NDB16PFC-4DET TR

$2.98
  • Description:IC DRAM 1GBIT SSTL 84FBGA
  • Series:NDB1L
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)

SKU:31824d0845d7 Category: Brand:

  
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NDB16PFC-4DET TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 1GBIT SSTL 84FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDB16PFC-4DET TR

  • Description:IC DRAM 1GBIT SSTL 84FBGA
  • Series:NDB1L
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:1Gbit
  • Memory Organization:64M x 16
  • Memory Interface:SSTL_18
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:84-TFBGA
  • Supplier Device Package:84-FBGA (8x12.5)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDB16PFC-4DET TR

NDB16PFC-4DET TR

Memory IC Overview

The NDB16PFC-4DET TR is a DDR2 SDRAM memory IC with a storage capacity of 1Gb, organized as 64M x 16. It operates at a clock frequency of 400 MHz and supports a data rate of 800 Mbps. The device utilizes an SSTL_18 interface and functions within a supply voltage range of 1.7V to 1.9V. It is housed in an 84-FBGA package measuring 8x12.5 mm. The component supports an operating temperature range from -40°C to 95°C.

Memory IC Feature Summary

  • Supports high-speed DDR2 synchronous dynamic random-access memory technology for efficient data processing.
  • Features a compact 84-FBGA surface-mount package designed for space-constrained embedded applications.
  • Operates with low-voltage power requirements suitable for modern electronic systems.

Memory IC Applications

  • Embedded systems requiring high-density volatile memory storage
  • Industrial applications needing reliable performance across wide temperature ranges
  • Consumer electronics utilizing DDR2 memory interfaces

Memory IC Procurement Notes

Verify the specific suffix (TR) indicates tape and reel packaging when ordering. Confirm that the 95°C maximum junction temperature rating aligns with your thermal design constraints. Ensure compatibility with SSTL_18 signaling standards in your system architecture before procurement.

Memory IC Selection Notes

Select this component for designs requiring 1Gb density in a small form factor. Consider the -40°C to 95°C temperature range for industrial or automotive environments. Verify that the 400 MHz clock speed meets the bandwidth requirements of your target application compared to lower-speed alternatives.

Memory IC Part Context

This part belongs to the Insignis Technology Corporation DDR2 memory family. It serves as a high-density solution for systems transitioning from older SDRAM technologies. The FBGA package offers improved electrical performance and thermal characteristics compared to traditional TSOP packages.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers include MT47H64M16NF-187E:M from Micron Technology Inc. and IS43DR16640C-25DBL from ISSI. These parts share similar DDR2 specifications and pinout configurations.

NDB16PFC-4DET TRNDB16PFC-4DET TR
$2.98
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