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NDB26PFC-4DET is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 2GBIT SSTL 84FBGA. Review the specifications below when checking this part for your BOM.
The NDB26PFC-4DET is a 2Gbit DDR2 Synchronous DRAM manufactured by Insignis Technology Corporation. It features a memory organization of 128M x 16 and operates with a clock frequency of 400 MHz. The device utilizes an SSTL_18 interface for signal transmission. It is housed in an 84-FBGA package with dimensions of 8x12.5 mm and a height of 1.2 mm. The component supports an operating temperature range of 0°C to 85°C (TC).
Verify the specific suffix 'DET' indicates Extended Test conditions as per manufacturer documentation. Confirm the package type is 84-FBGA (8x12.5) and the operating temperature range is 0°C to 85°C. Ensure compatibility with SSTL_18 signaling levels. Check RoHS3 compliance status if required for your assembly process. Validate that the part number matches the exact electrical specifications needed for your design.
Select this component when a 2Gbit DDR2 SDRAM is required with a 128M x 16 organization. It is suitable for designs needing 400 MHz operation and SSTL_18 I/O standards. The 84-FBGA package is appropriate for space-constrained applications. Consider the 0°C to 85°C operating range for commercial or industrial environments. Ensure the system supports the specific voltage requirements associated with SSTL_18.
This part belongs to the NDB26 series of DDR2 SDRAMs from Insignis Technology Corporation. The series offers various density and speed options. The NDB26PFC-4DET specifically provides 2Gbit capacity in an FBGA package. It is designed for high-performance memory applications requiring reliable volatile storage. The product line adheres to standard DDR2 protocols for broad compatibility.
The NDB26PFC-4DIT is a related variant with an industrial temperature range (-40°C to 95°C). Verify if the extended test condition of the DET version is critical for your application. Direct pin-to-pin replacements from other manufacturers require careful verification of timing parameters and voltage levels. Consult official substitution guides for cross-reference accuracy.
The memory organization is 128M x 16.
The maximum clock frequency is 400 MHz.
It uses an 84-FBGA package with dimensions of 8x12.5 mm.
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