Memory IC NDB26PFC-4DIT product image

NDB26PFC-4DIT

$7.14
  • Description:IC DRAM 2GBIT SSTL 84FBGA
  • Series:NDB2
  • Mfr:Insignis Technology Corporation
  • Package:Tray

SKU:1c49697ffe92 Category: Brand:

  
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NDB26PFC-4DIT is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 2GBIT SSTL 84FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDB26PFC-4DIT

  • Description:IC DRAM 2GBIT SSTL 84FBGA
  • Series:NDB2
  • Mfr:Insignis Technology Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR2
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:SSTL_18
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:84-TFBGA
  • Supplier Device Package:84-FBGA (8x12.5)
  • Access Time:400 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDB26PFC-4DIT

NDB26PFC-4DIT

Memory IC Overview

The NDB26PFC-4DIT is a DDR2 SDRAM memory IC manufactured by Insignis Technology Corporation. It features a 2Gbit capacity organized as 128M x 16 bits with an SSTL_18 interface. The device operates at a clock frequency of 400 MHz and supports a data rate of 400 MT/s. It utilizes an 84-ball FBGA package measuring 8x12.5 mm. The component is rated for an operating temperature range of -40°C to +95°C (TC). Key electrical specifications include a 400 ps access time.

Memory IC Feature Summary

  • High-density 2Gbit storage capacity optimized for compact PCB routing
  • Extended industrial temperature rating for reliable operation in harsh environments
  • SSTL_18 interface standard ensuring compatibility with DDR2 controllers

Memory IC Applications

  • Industrial embedded systems requiring wide temperature tolerance
  • Compact electronic devices utilizing FBGA footprint constraints
  • DDR2-based memory subsystems in consumer or industrial hardware

Memory IC Procurement Notes

Verify the specific suffix TR if tape-and-reel packaging is required, as the base part number may denote bulk or different packing. Confirm the 84-FBGA pinout matches your PCB layout design. Ensure the -40°C to +95°C temperature grade aligns with your system's thermal requirements. Cross-reference the datasheet for exact timing parameters before integration.

Memory IC Selection Notes

Select this component when a 2Gbit DDR2 density is necessary within an 84-ball FBGA form factor. The extended temperature range makes it suitable for applications exceeding commercial limits. Compare against the NDB26PFC-4DET variant if a lower 0°C to +85°C range suffices, as it offers similar electrical performance but different thermal ratings.

Memory IC Part Context

Insignis Technology Corporation specializes in DRAM design and manufacturing. This part belongs to their DDR2 SDRAM line, targeting markets needing high-density memory in small footprints. The company emphasizes reliability and specialized fabrication processes for emerging technology sectors.

Memory IC Replacement Considerations

The NDB26PFC-4DET is a verified alternative from the same manufacturer with identical electrical specifications but a reduced operating temperature range of 0°C to +85°C. Verify package compatibility and thermal management capabilities before substitution.

NDB26PFC-4DITNDB26PFC-4DIT
$7.14
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