NDD56PT6-2AIT

Memory IC Overview

The NDD56PT6-2AIT is a 512Mb DDR SDRAM memory IC manufactured by Insignis Technology Corporation. It features a parallel interface and operates at a clock frequency of 200 MHz with a cycle time of 700 ps. The device is internally configured as 32M x 16 and utilizes SSTL_2 signaling. It is housed in a 66-TSOP II package, supports surface mount installation, and functions within a voltage range of 3V to 3.6V across an operating temperature of -40°C to 85°C.

Memory IC Feature Summary

• Supports Double Data Rate synchronous DRAM technology for high-speed data transfer
• Utilizes SSTL_2 interface standard for compatibility with specific system architectures
• Provides volatile memory storage with 512Mb capacity organized as 32M x 16

Memory IC Applications

• Embedded systems requiring compact high-density memory solutions
• Consumer electronics utilizing DDR SDRAM interfaces
• Industrial control units operating within extended temperature ranges

Memory IC Procurement Notes

Verify the exact suffix (e.g., TR) against your bill of materials, as packaging variants exist. Confirm that the SSTL_2 voltage requirements align with your system's I/O standards. Ensure the 66-TSOP II footprint matches your PCB layout constraints. Check current availability status as supply levels may fluctuate. Validate RoHS compliance if required for your manufacturing process.

Memory IC Selection Notes

Select this component when a 512Mb density is required in a TSOP II form factor. The 200 MHz speed class suits applications needing moderate-to-high bandwidth without the complexity of higher-speed DDR generations. Consider the SSTL_2 interface requirement carefully, as it dictates signal integrity design rules. The wide temperature range makes it suitable for environments where standard commercial grade parts would fail.

Memory IC Part Context

This part belongs to the NDD series of DDR SDRAMs from Insignis Technology Corporation. It represents a mid-density solution compared to smaller 64Mb/128Mb variants or larger 1Gb parts. The TSOP II package offers a balance between pin count and board space efficiency. It serves as a direct replacement for legacy DDR components in designs upgrading capacity while maintaining interface compatibility.

Memory IC Replacement Considerations

Check for parameter-equivalent substitutes such as the NDD56PT6-2AIT TR variant which shares identical electrical specifications but differs in tape-and-reel packaging. Verify pinout compatibility before substituting with parts from other manufacturers to ensure functional equivalence.