NDL26PFG-8KIT TR

Memory IC Overview

The NDL26PFG-8KIT TR is a volatile SDRAM component manufactured by Insignis Technology Corporation. It features a DDR3L memory type with a 2Gbit (128M x 16) capacity. The device utilizes a parallel interface and operates at a clock frequency of 800 MHz. Key electrical parameters include an access time of 20 ns and a write cycle time of 15 ns for word and page operations. It is housed in a 96-FBGA package measuring 7.5x13 mm and supports an operating temperature range of -40°C to 95°C.

Memory IC Feature Summary

• DDR3L SDRAM architecture for low-power volatile memory storage
• Parallel interface supporting high-speed data transfer
• Fast access times suitable for real-time processing applications

Memory IC Applications

• Real-time data processing systems
• High-speed data transfer interfaces
• Embedded memory solutions requiring low power consumption

Memory IC Procurement Notes

Verify the specific package dimensions and pinout configuration against your PCB design requirements, as variations exist within the FBGA family. Confirm the operating temperature range meets your environmental specifications. Check product status, as this item may be listed as obsolete in some distributor catalogs. Ensure compatibility with DDR3L voltage levels and timing constraints for your target application.

Memory IC Selection Notes

Select this component when a 2Gbit parallel SDRAM solution is required with specific 800 MHz speed capabilities. Consider the 96-FBGA footprint for board space constraints. Evaluate the -40°C to 95°C industrial temperature range against your operational environment. Compare access times and power profiles with alternative DDR3L devices if system latency or energy efficiency are critical design factors.

Memory IC Part Context

This part belongs to the Insignis Technology Corporation NDL26 series of DDR3L memory ICs. The series offers various capacities and package options for embedded memory needs. The NDL26PFG-8KIT TR specifically denotes the 2Gbit variant with a 96-FBGA package and tape-and-reel packaging. It is designed for applications demanding reliable volatile memory with standard DDR3L electrical characteristics.

Memory IC Replacement Considerations

Direct substitutes include NDL26PFG-8KET TR and NDL26PFG-9MI TR from the same manufacturer. Verify package compatibility and pin assignments before substitution. Cross-reference datasheets for any differences in timing parameters or thermal ratings.