Memory IC NDL26PFI-8KIT product image

NDL26PFI-8KIT

$5.52
  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tray

SKU:bb597eb03948 Category: Brand:

  
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NDL26PFI-8KIT is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 2GBIT PARALLEL 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDL26PFI-8KIT

  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-FBGA (7.5x13)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDL26PFI-8KIT

NDL26PFI-8KIT

Memory IC Overview

The NDL26PFI-8KIT is a DDR3L SDRAM memory IC manufactured by Insignis Technology Corporation. It features a 2Gbit capacity organized as 128M x 16 bits. The device supports a parallel interface with a clock frequency of 800 MHz and a access time of 20 ns. It operates within a voltage range of 1.283V to 1.45V and functions at temperatures from -40°C to +95°C. The component is housed in a 96-FBGA package measuring 7.5x13 mm.

Memory IC Feature Summary

  • DDR3L low-voltage SDRAM technology for reduced power consumption
  • High-speed parallel data interface supporting 800 MHz operation
  • Extended industrial temperature range capability
  • Compact surface-mount FBGA packaging

Memory IC Applications

  • Industrial embedded systems requiring robust memory solutions
  • Consumer electronics utilizing DDR3L standards
  • Automotive infotainment and control modules
  • Network infrastructure equipment

Memory IC Procurement Notes

Verify the specific suffix (e.g., TR) against the manufacturer's official documentation to confirm tape-and-reel packaging requirements. Ensure compatibility with the target system's voltage levels, which must fall between 1.283V and 1.45V. Confirm that the PCB footprint matches the 96-FBGA (7.5x13) dimensions precisely to avoid assembly errors.

Memory IC Selection Notes

Select this component when a 2Gbit density with 16-bit width is required for DDR3L applications. Consider the 800 MHz speed grade if higher bandwidth is necessary compared to standard DDR3L speeds. The extended temperature range makes it suitable for environments exceeding commercial limits. Verify that the FBGA package size fits the available board space constraints.

Memory IC Part Context

This part belongs to the Insignis Technology DDR3L memory series, designed for high-density storage needs. It complements other variants like the NDS76PT5-16IT and NDL88PFO-8KIT within the manufacturer's portfolio. The series targets markets demanding reliable SDRAM performance with low power characteristics in compact form factors.

Memory IC Replacement Considerations

Direct substitutes may include parts from other manufacturers offering identical 2Gb 16-bit DDR3L specifications in 96-FBGA packages. Verify pin-to-pin compatibility and electrical parameters before substitution. Cross-reference with Insignis variants such as NDL26PFI-9MET TR for potential family upgrades or alternatives.

NDL26PFI-8KITNDL26PFI-8KIT
$5.52
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