Memory IC NDL26PFJ-8KET TR product image

NDL26PFJ-8KET TR

  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)

SKU:141ee2e66c90 Category: Brand:

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NDL26PFJ-8KET TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 2GBIT PARALLEL 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDL26PFJ-8KET TR

  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-FBGA (7.5x13)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDL26PFJ-8KET TR

NDL26PFJ-8KET TR

Memory IC Overview

The NDL26PFJ-8KET TR is a SDRAM - DDR3L memory IC manufactured by Insignis Technology Corporation. It offers a storage capacity of 2Gb, organized as 128M x 16 bits. The device utilizes a parallel interface and operates with a clock frequency of 800 MHz. Key timing parameters include an access time of 20 ns and a write cycle time of 15 ns for word/page operations. It functions within a supply voltage range of 1.425V to 1.575V and supports a wide operating temperature range from -40°C to 95°C (TC). The component is housed in a 96-VFBGA package measuring 7.5x13 mm.

Memory IC Feature Summary

  • DDR3L low-voltage technology for reduced power consumption
  • Parallel interface architecture for high-speed data transfer
  • Wide industrial temperature range support
  • Compact 96-pin FBGA surface-mount packaging

Memory IC Applications

  • Embedded systems requiring volatile memory
  • Industrial control units
  • Consumer electronics with space constraints

Memory IC Procurement Notes

Verify the exact suffix configuration against official Insignis Technology Corporation documentation to ensure compatibility with specific voltage or temperature grades. Confirm package dimensions and pinout details prior to integration. Check for end-of-life status or alternative sourcing options as availability may vary. Ensure compliance with RoHS3 and REACH regulations for your target market.

Memory IC Selection Notes

Select this component when a 2Gb parallel SDRAM solution is required with DDR3L efficiency. Consider the 96-FBGA footprint for board layout constraints. Evaluate the 800 MHz speed against system bus requirements. Ensure the design accommodates the specified 1.425V-1.575V supply rail and thermal management for the -40°C to 95°C range.

Memory IC Part Context

This part belongs to the NDL26 series of DDR3L memory devices from Insignis Technology Corporation. It shares architectural similarities with other parts in the family but differs in capacity and specific electrical characteristics. The manufacturer focuses on fabless DRAM design, offering alternatives to traditional memory manufacturing approaches.

Memory IC Replacement Considerations

Consult official substitution guides for compatible 2Gb DDR3L parallel SDRAMs. Verify pin-to-pin compatibility and electrical specifications before replacing. No direct public substitute part numbers are confirmed in the provided source material.

NDL26PFJ-8KET TRNDL26PFJ-8KET TR

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