Memory IC NDL26PFJ-9MIT TR product image

NDL26PFJ-9MIT TR

  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)

SKU:12f166838f24 Category: Brand:

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NDL26PFJ-9MIT TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 2GBIT PARALLEL 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDL26PFJ-9MIT TR

  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-FBGA (7.5x13)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDL26PFJ-9MIT TR

NDL26PFJ-9MIT TR

Memory IC Overview

The NDL26PFJ-9MIT TR is a DDR3L SDRAM memory IC manufactured by Insignis Technology Corporation. It features a 2Gbit capacity organized as 128M x 16 bits. The component supports parallel data interfaces with a clock frequency of 933 MHz and a access time of 20 ns. It is housed in a 96-FBGA package measuring 7.5x13 mm.

Memory IC Feature Summary

  • DDR3L low voltage SDRAM technology for power efficiency
  • Parallel interface supporting high-speed data transfer at 933 MHz
  • Compact 96-FBGA surface mount packaging

Memory IC Applications

  • Embedded systems requiring volatile memory storage
  • Consumer electronics devices utilizing DDR3L standards
  • Industrial control units needing compact memory solutions

Memory IC Procurement Notes

Verify the exact package dimensions and pinout configuration against your PCB layout requirements before procurement. Confirm that the supply voltage specifications align with your system's power rails, as DDR3L operates at specific low voltage levels distinct from standard DDR3. Ensure thermal management strategies are adequate for the FBGA form factor under expected operating conditions.

Memory IC Selection Notes

Select this component when a 2Gbit density with 16-bit width is required in a small footprint. Compare the 933 MHz speed grade against system bus requirements to ensure timing compatibility. Consider the 96-FBGA package size relative to available board space and soldering capabilities compared to alternative memory packages.

Memory IC Part Context

Insignis Technology Corporation specializes in DRAM design and manufacturing. This part belongs to their DDR3L SDRAM line, offering alternatives to traditional memory suppliers. The NDL26 series provides scalable memory solutions for various embedded applications requiring reliable volatile storage.

Memory IC Replacement Considerations

Check for direct substitutes such as the NDL26PFG-9MI TR or NDL26PFJ-8KIT TR within the same manufacturer's lineup. Verify pin-to-pin compatibility and electrical parameter equivalence before substitution.

NDL26PFJ-9MIT TRNDL26PFJ-9MIT TR

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