Memory IC NDL56PFJ-8KIT TR product image

NDL56PFJ-8KIT TR

$2.49
  • Description:IC DRAM 512MBIT PAR 96FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)

SKU:feaedb4725f0 Category: Brand:

  
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NDL56PFJ-8KIT TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 512MBIT PAR 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDL56PFJ-8KIT TR

  • Description:IC DRAM 512MBIT PAR 96FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:512Mbit
  • Memory Organization:32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-FBGA (8x13)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDL56PFJ-8KIT TR

NDL56PFJ-8KIT TR

Memory IC Overview

The NDL56PFJ-8KIT TR is a SDRAM - DDR3 memory IC manufactured by Insignis Technology Corporation. It features a parallel interface with a storage capacity of 1Gb and an organization of 64M x 16. The device operates at a clock frequency of 800 MHz with a write cycle time of 15ns and an access time of 20 ns. It requires a supply voltage between 1.425V and 1.575V. The component is housed in a 96-FBGA (8x13) surface-mount package and supports a wide operating temperature range from -40°C to 95°C (TC).

Memory IC Feature Summary

  • DDR3 SDRAM technology for high-speed data processing.
  • Parallel interface supporting 64M x 16 memory organization.
  • Wide industrial temperature range capability.

Memory IC Applications

  • High-performance embedded systems requiring volatile memory.
  • Industrial control units operating in extreme temperatures.
  • Consumer electronics utilizing DDR3 architecture.

Memory IC Procurement Notes

Verify the exact suffix and tape-and-reel quantity against the manufacturer's latest documentation, as packaging details can vary. Confirm RoHS3 compliance status directly with the supplier or official datasheet before integration. Ensure the specific batch matches the required moisture sensitivity level (MSL 3) for your assembly process timeline.

Memory IC Selection Notes

Select this component when a parallel DDR3 interface is required for 1Gb capacity within a compact 96-pin footprint. Consider the 1.5V nominal voltage requirement and the specific 800 MHz speed grade. Evaluate thermal management needs due to the extended -40°C to 95°C operational range compared to commercial grade parts.

Memory IC Part Context

This part belongs to the NDL56 series of synchronous dynamic random-access memory devices. It is designed for applications demanding reliable volatile storage with fast access times. The FBGA package facilitates dense PCB layouts while maintaining signal integrity for high-frequency operations typical of DDR3 standards.

Memory IC Replacement Considerations

Check for direct pin-to-pin replacements within the same NDL56 family that may offer updated manufacturing dates or different suffix variations. Verify compatibility with existing board designs if substituting with similar DDR3 parts from other vendors, ensuring voltage and timing parameters align.

Memory IC FAQ

What is the maximum operating temperature for this DRAM?

The device supports an extended temperature range up to 95°C (TC).

Does this component support low-power modes?

As a standard DDR3 SDRAM, it supports power-down and self-refresh modes typical of the DDR3 specification.

NDL56PFJ-8KIT TRNDL56PFJ-8KIT TR
$2.49
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