NDL86PFE-8KIT

Memory IC Overview

The NDL86PFE-8KIT is an 8Gbit DDR3L SDRAM memory IC manufactured by Insignis Technology Corporation. It features a parallel interface with an X16 data bus width and operates at a clock frequency of 800 MHz, delivering a data rate of 1600 Mbps. The device is organized as 512Mx16 and requires a supply voltage (Vcc) of 1.35 V. It is housed in a 96-pin FBGA package measuring 9x13.5 mm with a height of 1.2 mm. The component supports an operating temperature range from -40°C to +95°C.

Memory IC Feature Summary

• Supports low-voltage DDR3L operation at 1.35 V for enhanced power efficiency
• High-speed parallel data transfer capability with 1600 Mbps data rate
• Robust industrial-grade thermal performance suitable for wide temperature environments

Memory IC Applications

• Embedded systems requiring high-density memory storage
• Industrial control units operating in extreme temperatures
• Consumer electronics utilizing DDR3L interfaces

Memory IC Procurement Notes

Verify the specific suffix (e.g., TR for tape and reel or standard tray packaging) against your assembly requirements before ordering. Confirm that the 1.35 V supply voltage aligns with your system design, as this is a low-voltage DDR3L component. Ensure compatibility with the 96-FBGA footprint on your PCB layout. Cross-reference the manufacturer's latest datasheet for any updates on pin configurations or electrical characteristics to guarantee proper integration.

Memory IC Selection Notes

Select this component when an 8 Gbit capacity with a 16-bit data bus is required. It is suitable for designs needing 800 MHz clock speeds and low-power operation. Consider the BGA96 package constraints during PCB design. Verify that the -40°C to +95°C temperature range meets your environmental specifications. This part is ideal for applications where space is limited but high memory density is necessary.

Memory IC Part Context

This memory IC belongs to the DDR3L family produced by Insignis Technology Corporation. It is designed to replace older DDR standards while offering lower power consumption. The 96-FBGA package allows for compact board layouts. It serves as a critical storage solution for modern embedded applications requiring reliable high-speed data access within strict power and size limitations.

Memory IC Replacement Considerations

Check for direct substitutes such as the NDL86PFG-8KIT or NDL86PFE-8KET if different packaging or temperature grades are needed. Ensure any replacement maintains the 8Gbit density, X16 organization, and 1.35 V operation. Verify pin-to-pin compatibility with the 96-FBGA footprint before switching components.