Memory IC NDL86PFG-8KET TR product image

NDL86PFG-8KET TR

$16.60
  • Description:IC DRAM 8GBIT PARALLEL 96FBGA
  • Series:NDL86P
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)

SKU:c08cdb807c4b Category: Brand:

  
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NDL86PFG-8KET TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 8GBIT PARALLEL 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDL86PFG-8KET TR

  • Description:IC DRAM 8GBIT PARALLEL 96FBGA
  • Series:NDL86P
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:8Gbit
  • Memory Organization:512M x 16
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-TFBGA
  • Supplier Device Package:96-FBGA (9x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDL86PFG-8KET TR

NDL86PFG-8KET TR

Memory IC Overview

The NDL86PFG-8KET TR is a DDR3L SDRAM memory IC manufactured by Insignis Technology Corporation. It features an 8Gbit density organized as 512M x 16 bits. The device operates with a parallel interface and supports clock frequencies up to 800 MHz, corresponding to a data rate of 1600 Mbps. It utilizes a 96-FBGA package measuring 9x13 mm. The component functions within an extended temperature range from -40°C to 95°C and requires a supply voltage of 1.35 V.

Memory IC Feature Summary

  • Supports low-voltage DDR3L operation at 1.35 V for enhanced power efficiency
  • Provides high-speed parallel data transfer capabilities up to 1600 Mbps
  • Engineered for extended industrial temperature environments ranging from -40°C to 95°C

Memory IC Applications

  • Industrial control systems requiring reliable memory in extreme temperatures
  • Embedded computing platforms utilizing DDR3L interfaces
  • High-density storage solutions for consumer electronics

Memory IC Procurement Notes

Verify the specific ordering suffix 'TR' indicates tape-and-reel packaging configuration when sourcing. Confirm that the 96-FBGA footprint matches the target PCB design constraints. Ensure compatibility with 1.35 V power domains. Cross-reference the manufacturer datasheet for exact pinout definitions and electrical characteristics prior to integration.

Memory IC Selection Notes

Select this component for applications demanding high-density memory in compact form factors. The 512M x 16 organization suits systems requiring wide data buses. Consider the extended temperature rating for harsh environment deployments. Validate signal integrity requirements for 800 MHz operation on the motherboard layout.

Memory IC Part Context

This part belongs to the NDL86PFG series of DDR3L synchronous dynamic random-access memories. It shares the same physical package and core architecture as variants like NDL86PFG-8KIT but differs in packaging format. The series targets markets needing robust memory solutions with standardized DDR3L electrical specifications.

Memory IC Replacement Considerations

Direct substitutes include other 8Gbit DDR3L devices in 96-FBGA packages from compatible manufacturers. Verify pin-to-pin compatibility and timing parameters before substitution. Alternative parts must support the same 1.35 V operating voltage and extended temperature range.

NDL86PFG-8KET TRNDL86PFG-8KET TR
$16.60
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