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NDL86PFG-9MIT is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 8GBIT PARALLEL 96FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for NDL86PFG-9MIT
- Description：IC DRAM 8GBIT PARALLEL 96FBGA
- Series：NDL86P
- Mfr：Insignis Technology Corporation
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - DDR3L
- Memory Size：8Gbit
- Memory Organization：512M x 16
- Memory Interface：Parallel
- Clock Frequency：933 MHz
- Write Cycle Time - Word, Page：15ns
- Voltage - Supply：1.283V ~ 1.45V
- Operating Temperature：-40°C ~ 95°C (TC)
- Mounting Type：Surface Mount
- Package / Case：96-TFBGA
- Supplier Device Package：96-FBGA (9x13)
- Access Time：20 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for NDL86PFG-9MIT
Memory IC Overview
The NDL86PFG-9MIT is a DDR3L SDRAM memory IC manufactured by Insignis Technology Corporation. It features an 8Gbit density organized as 512M x 16 bits. The device supports a clock frequency of 933 MHz with a data rate of 1866 Mbps and access times of 20 ns. It operates at 1.35 V and utilizes a 96-pin FBGA package measuring 9x13 mm. The component is rated for an operating temperature range of -40°C to 95°C.
Memory IC Feature Summary
- Supports low voltage operation at 1.35V for energy efficiency
- Provides high-speed parallel data interface capabilities
- Designed for industrial-grade wide temperature stability
Memory IC Applications
- Industrial control systems requiring reliable volatile memory
- Embedded computing platforms needing high-density storage
- Automotive electronics operating in extreme temperatures
Memory IC Procurement Notes
Verify the specific suffix 'TR' if tape-and-reel packaging is required, as standard listings may indicate tray packaging. Confirm the exact pinout and electrical characteristics against the official datasheet before integration. Ensure the supplier provides genuine components from Insignis Technology Corporation to guarantee performance specifications are met.
Memory IC Selection Notes
Select this component when a high-density 8Gbit DDR3L solution is needed with a compact FBGA footprint. It is suitable for designs requiring 1.35V operation and industrial temperature ranges. Consider the 96-pin configuration and surface-mount requirements during PCB layout planning.
Memory IC Part Context
This part belongs to the NDL8 series of DDR3L memory devices from Insignis Technology Corporation. These components are designed to offer high performance and reliability for demanding applications. The series supports various densities and organizations to meet different system memory requirements.
Memory IC Replacement Considerations
Check for compatible DDR3L parts with matching 8Gbit density and 16-bit organization. Verify that alternative packages fit the existing footprint or require redesign. Ensure voltage and temperature ratings meet the original design constraints.
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