NDL88PFO-9MIT

Memory IC Overview

The NDL88PFO-9MIT is a DDR3L SDRAM memory IC manufactured by Insignis Technology Corporation. It features an 8Gbit capacity organized as x8 width. The device operates at a clock frequency of 933 MHz with a 20 ns access time. It utilizes a 78-ball TFBGA package measuring 9x10.6 mm with a height of 1.2 mm. The component supports an industrial temperature range from -40°C to 95°C and is designed for parallel data interface applications.

Memory IC Feature Summary

• Supports DDR3L low voltage operation standards
• Industrial temperature rating for extended environmental reliability
• Compact thin-profile FBGA packaging

Memory IC Applications

• Embedded systems requiring volatile memory storage
• Industrial control equipment
• Consumer electronics utilizing DDR3L interfaces

Memory IC Procurement Notes

Verify the specific ordering suffix against official documentation, as variations may exist. Confirm that the required package dimensions and pinout match your PCB layout constraints. Ensure compatibility with the target system's voltage levels and signal integrity requirements before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when an 8Gbit DDR3L solution is required within strict spatial limitations due to its small footprint. Consider the industrial temperature range if the application environment exceeds standard commercial limits. Validate that the 933 MHz speed meets the bandwidth demands of the host processor or controller.

Memory IC Part Context

Insignis Technology Corporation specializes in DRAM design and manufacturing without owning fabrication facilities. This part represents their focus on providing alternative memory solutions for emerging markets. The company maintains ISO 9001 certification for quality management in its production processes.

Memory IC Replacement Considerations

Check for exact pin-to-pin compatible alternatives with identical electrical specifications. Verify that any substitute maintains the same 78-TFBGA package dimensions and thermal characteristics to ensure mechanical fit.