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NDQ46PFI-6NIT TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 4GBIT POD 96FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for NDQ46PFI-6NIT TR
- Description：IC DRAM 4GBIT POD 96FBGA
- Series：-
- Mfr：Insignis Technology Corporation
- Package：Tape & Reel (TR),Cut Tape (CT)
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - DDR4
- Memory Size：4Gbit
- Memory Organization：256M x 16
- Memory Interface：POD
- Clock Frequency：1.6 GHz
- Write Cycle Time - Word, Page：15ns
- Voltage - Supply：1.14V ~ 1.26V
- Operating Temperature：-40°C ~ 95°C (TC)
- Mounting Type：Surface Mount
- Package / Case：96-TFBGA
- Supplier Device Package：96-FBGA (7.5x13)
- Access Time：18 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for NDQ46PFI-6NIT TR
Memory IC Overview
The NDQ46PFI-6NIT TR is a DDR4 SDRAM memory IC manufactured by Insignis Technology Corporation. It features a storage capacity of 4Gbit organized as 256M x 16 bits. The device operates with a clock frequency of 1.6 GHz and supports a data rate of 3200 Mbps. It utilizes a 96-FBGA package measuring 7.5x13 mm. The operating voltage is 1.2 V, and the component is rated for an ambient temperature range of -40°C to 95°C.
Memory IC Feature Summary
- DDR4 SDRAM technology implementation
- High-speed data transfer capabilities
- Compact FBGA surface-mount packaging
Memory IC Applications
- Computer memory systems
- Embedded computing platforms
- Industrial control equipment
Memory IC Procurement Notes
Verify the specific suffix 'TR' indicates tape-and-reel packaging configuration. Confirm the manufacturer part number matches the requested density and organization. Ensure environmental ratings align with operational requirements. Check RoHS compliance status for regulatory adherence. Validate package dimensions against PCB footprint specifications.
Memory IC Selection Notes
Select this component for applications requiring DDR4 performance in compact form factors. Consider the 96-FBGA package constraints during layout design. Evaluate thermal management needs given the wide operating temperature range. Verify compatibility with system controller interfaces supporting DDR4 protocols. Assess power supply stability for the 1.2V requirement.
Memory IC Part Context
This part belongs to the NDQ series of DDR4 memory solutions from Insignis Technology Corporation. It represents a high-density volatile memory option designed for modern electronic systems. The series typically offers various organizational configurations to suit different bandwidth and capacity needs within the DDR4 standard framework.
Memory IC Replacement Considerations
Cross-reference with other DDR4 4Gb x16 FBGA components from Insignis or alternative manufacturers. Verify pinout compatibility and electrical characteristics before substitution. Ensure timing parameters meet system requirements.
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