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NDQ48PFQ-8XIT TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 4GBIT POD 78FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for NDQ48PFQ-8XIT TR
- Description：IC DRAM 4GBIT POD 78FBGA
- Series：-
- Mfr：Insignis Technology Corporation
- Package：Tape & Reel (TR)
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - DDR4
- Memory Size：4Gbit
- Memory Organization：512M x 8
- Memory Interface：POD
- Clock Frequency：1.2 GHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.14V ~ 1.26V
- Operating Temperature：-40°C ~ 95°C (TC)
- Mounting Type：Surface Mount
- Package / Case：78-TFBGA
- Supplier Device Package：78-FBGA (7.5x10.6)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for NDQ48PFQ-8XIT TR
Memory IC Overview
The NDQ48PFQ-8XIT TR is a DDR4 SDRAM component manufactured by Insignis Technology Corporation. It features a parallel interface and operates within an extended temperature range of -40°C to +95°C (TC). The device is designed for surface mount installation in a 96-FBGA package, specifically sized at 7.5x13 mm or 8x13 mm depending on the specific variant configuration. As a volatile memory type, it provides high-speed data access suitable for demanding industrial and automotive environments requiring robust reliability.
Memory IC Feature Summary
- Extended temperature operation capability for industrial and automotive applications
- DDR4 technology with parallel interface for high-speed data transfer
- Automotive qualification for infotainment and driver information systems
Memory IC Applications
- Industrial IoT embedded systems
- Autonomous transportation control units
- Automotive infotainment systems
- Driver information displays
Memory IC Procurement Notes
Verify the exact package dimensions and speed grade against the official datasheet before procurement. Confirm that the 'TR' suffix indicates tape and reel packaging if required for automated assembly. Ensure compatibility with the target system's voltage levels and clock frequencies. Check for any specific automotive qualification certifications required for the end application.
Memory IC Selection Notes
Select this component when wide operating temperature ranges are critical for system stability. Consider the 96-FBGA footprint for PCB layout constraints. Evaluate the DDR4 performance characteristics against system bandwidth requirements. Ensure the manufacturer's long-term supply commitment aligns with product lifecycle needs.
Memory IC Part Context
Insignis Technology Corporation specializes in fabless DRAM design focusing on industrial and automotive markets. The company emphasizes supply stability and avoids die shrinks to ensure long-term support. This part belongs to their DDR4 portfolio, designed for applications requiring high reliability and extended temperature tolerance compared to standard commercial components.
Memory IC Replacement Considerations
Consult official substitution lists from Insignis Technology Corporation for verified equivalents. Cross-reference pinouts and electrical specifications carefully. Verify that any substitute maintains the same package size and thermal characteristics. Do not assume compatibility based solely on capacity or speed ratings.
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