NDS36PBA-16AT TR

Memory IC Overview

The NDS36PBA-16AT TR is a Synchronous Dynamic Random Access Memory (SDRAM) integrated circuit manufactured by Insignis Technology Corporation. It provides a total storage capacity of 256 Mbit, organized as 16 Megwords by 16 bits. The device operates with a parallel interface and supports a clock frequency of 166 MHz, corresponding to PC166 specifications. It utilizes Low Voltage TTL (LVTTL) compatible logic levels for signal interfacing. The component is housed in a 54-ball Fine-Pitch Ball Grid Array (FBGA) package with dimensions of 8x8 mm and a height of 1.2 mm. The 'AT' suffix indicates an extended industrial temperature range from -40°C to +105°C.

Memory IC Feature Summary

• High-speed parallel data transfer capability enabled by 166 MHz clock operation
• Industrial-grade reliability with extended temperature range support
• Compact surface-mount packaging suitable for space-constrained designs

Memory IC Applications

• Embedded memory systems requiring high-density storage
• Industrial control units operating in extreme temperatures
• Consumer electronics utilizing LVTTL interfaces

Memory IC Procurement Notes

Verify the specific revision level and date code upon receipt to ensure compatibility with your system requirements. Confirm that the FBGA footprint matches your PCB design exactly. Check for any RoHS compliance documentation if required by your manufacturing standards. Ensure proper handling procedures are followed due to the fine-pitch ball grid array package type.

Memory IC Selection Notes

Select this component when a 256 Mbit density is required within a compact 8x8 mm footprint. The 16-bit width suits applications needing wider data buses without increasing pin count significantly. Consider the -40°C to +105°C range if the environment exceeds commercial limits. Verify voltage compatibility with the host processor's I/O levels before integration.

Memory IC Part Context

This part belongs to the NDS series of SDRAMs from Insignis Technology Corporation. It shares architectural similarities with other members like the NDS36PT5-16IT but differs in package type and temperature rating. The BGA variant offers better thermal performance and smaller board area compared to TSOP alternatives in the same family.

Memory IC Replacement Considerations

Direct substitutes include NDS36PBA-16ET TR and NDS36PBA-16IT TR from the same manufacturer. These parts share identical electrical characteristics and pinouts but may differ in temperature ranges or package variants. Cross-vendor replacements require careful verification of timing parameters and physical dimensions.