NDS36PBA-16ET

Memory IC Overview

The NDS36PBA-16ET is a Synchronous Dynamic Random Access Memory (SDRAM) integrated circuit manufactured by Insignis Technology Corporation. It provides a total storage capacity of 256 Megabits, organized as 16 Megawords by 16 bits. The device operates with an LVTTL interface and supports a clock frequency of 166 MHz. It is housed in a 54-pin Thin Shrink Small Outline Package (TSOP II) with a width of 10.16 mm. The component functions within a supply voltage range of 3V to 3.6V and is rated for an operating temperature range of -40°C to 85°C.

Memory IC Feature Summary

• Supports high-speed parallel data transfer via LVTTL interface at 166 MHz
• Provides 256Mb density with 16M x 16 organization for efficient memory management
• Designed for surface-mount installation in compact electronic assemblies

Memory IC Applications

• Portable consumer electronics requiring volatile memory storage
• Embedded systems utilizing low-voltage logic interfaces
• Industrial control units operating within extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix against official manufacturer documentation to confirm package type and speed grade. Ensure compatibility with system voltage requirements and thermal constraints before integration. Confirm RoHS compliance status through current datasheets. Cross-reference part numbers with authorized distributors to avoid counterfeit components.

Memory IC Selection Notes

Select this component when a 256Mb SDRAM solution with LVTTL compatibility is required. Consider the TSOP II package for space-constrained designs where leaded packages are unsuitable. Evaluate the 166 MHz performance against system bus speeds. Verify that the 3V to 3.6V supply range aligns with the target platform's power architecture.

Memory IC Part Context

This part belongs to the NDS36P series of SDRAM devices from Insignis Technology Corporation. The series includes variants with different speed grades and packaging options, such as the NDS36PT5-16IT TR in TSOP II and the NDS36PBA-20IT in FBGA. These components share common architectural features but differ in electrical characteristics and physical form factors.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers for this specific component were not identified in the provided source material.