Memory IC NDS36PBA-20IT product image

NDS36PBA-20IT

$3.73
  • Description:IC DRAM 256MBIT LVTTL 54FBGA
  • Series:NDS36P
  • Mfr:Insignis Technology Corporation
  • Package:Tray

SKU:4b7ff9a49b61 Category: Brand:

  
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NDS36PBA-20IT is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 256MBIT LVTTL 54FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDS36PBA-20IT

  • Description:IC DRAM 256MBIT LVTTL 54FBGA
  • Series:NDS36P
  • Mfr:Insignis Technology Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM
  • Memory Size:256Mbit
  • Memory Organization:16M x 16
  • Memory Interface:LVTTL
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:10ns
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:54-TFBGA
  • Supplier Device Package:54-FBGA (8x8)
  • Access Time:4.5 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDS36PBA-20IT

NDS36PBA-20IT

Memory IC Overview

The NDS36PBA-20IT is a Synchronous Dynamic Random Access Memory (SDRAM) integrated circuit manufactured by Insignis Technology Corporation. It provides a storage capacity of 256 Megabits, organized as 16 Megawords by 16 bits. The device utilizes an LVTTL interface and operates with a clock frequency of 200 MHz. Key timing specifications include a write cycle time of 10 nanoseconds for word/page operations and an access time of 4.5 nanoseconds. It functions within a supply voltage range of 3V to 3.6V and supports an operating temperature range from -40°C to 85°C. The component is housed in a 54-pin Thin Fine-pitch Ball Grid Array (TFBGA) package, specifically identified as 54-FBGA with dimensions of 8x8 mm.

Memory IC Feature Summary

  • Supports high-speed data transfer via a 200 MHz clock frequency and 4.5 ns access time.
  • Features a compact 54-pin TFBGA surface-mount package suitable for space-constrained designs.
  • Operates reliably across industrial temperature ranges from -40°C to 85°C.

Memory IC Applications

  • Embedded systems requiring volatile memory storage
  • Industrial control units operating in wide temperature environments
  • Consumer electronics utilizing LVTTL interfaces

Memory IC Procurement Notes

Verify the specific package variant, as the NDS36P series includes both TSOP II and FBGA options. Confirm that the 200 MHz speed grade matches the system requirements, distinguishing it from lower-frequency variants like the 166 MHz models. Ensure compatibility with LVTTL logic levels and verify RoHS3 compliance status for environmental regulations.

Memory IC Selection Notes

Select this component when a 256Mb density with a 16-bit data width is required. The 200 MHz performance rating makes it suitable for applications needing faster access times compared to standard 166 MHz parts. The TFBGA package is ideal for high-density PCB layouts where board space is limited compared to TSOP packages.

Memory IC Part Context

This part belongs to the NDS36P family of SDRAM devices from Insignis Technology Corporation. The family offers various speed grades and packaging options, including TSOP II and FBGA configurations. The NDS36PBA-20IT specifically denotes the FBGA package variant with a 200 MHz operational speed, differentiating it from other members like the NDS36PT5 series which uses TSOP packaging.

Memory IC FAQ

What is the difference between NDS36PBA-20IT and NDS36PT5-16IT?

The primary differences are the package type and speed grade. The NDS36PBA-20IT uses a 54-FBGA package and operates at 200 MHz, whereas the NDS36PT5-16IT uses a 54-TSOP II package and operates at 166 MHz.

Does the NDS36PBA-20IT support low-voltage operation below 3V?

No, the specified supply voltage range for this component is 3V to 3.6V. Operation below 3V is outside the documented electrical specifications.

NDS36PBA-20ITNDS36PBA-20IT
$3.73
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