NDS66PBA-16ET TR

Memory IC Overview

The NDS66PBA-16ET TR is a Synchronous Dynamic Random Access Memory (SDRAM) integrated circuit manufactured by Insignis Technology Corporation. It features a storage capacity of 64 Mbit, organized as 4M x 16 bits. The device supports an LVTTL interface and operates at a clock frequency of 166 MHz with an access time of 5.4 ns. It functions within a supply voltage range of 3V to 3.6V and is housed in a 54-TFBGA package measuring 8x8 mm. The component is designed for surface mount installation and complies with RoHS3 standards.

Memory IC Feature Summary

• Supports high-speed data transfer via LVTTL interface at 166 MHz
• Compact 54-pin TFBGA package suitable for space-constrained designs
• Operates reliably across industrial temperature ranges

Memory IC Applications

• Embedded systems requiring volatile memory storage
• Consumer electronics utilizing SDRAM interfaces
• Industrial control units needing reliable data retention during operation

Memory IC Procurement Notes

Verify the specific suffix 'TR' indicates tape and reel packaging when ordering. Confirm that the 54-TFBGA footprint matches the target PCB design. Ensure the system power supply remains within the 3V to 3.6V range to prevent damage. Check for RoHS3 compliance requirements if exporting to regulated regions. Validate the 166 MHz speed grade against system timing constraints.

Memory IC Selection Notes

Select this component when a 64 Mbit SDRAM solution with LVTTL compatibility is required. The 166 MHz speed rating suits applications needing moderate data throughput. The 54-TFBGA package offers a balance between pin count and board area. Consider the -40°C to 85°C operating range for broader environmental adaptability compared to commercial-grade parts.

Memory IC Part Context

This part belongs to the NDS66 series of SDRAM devices from Insignis Technology Corporation. The series typically includes variants with different speeds and packages. The NDS66PBA-16ET TR specifically denotes the 166 MHz speed bin and tape-and-reel packaging format. It serves as a standard volatile memory solution for legacy or cost-sensitive embedded architectures.

Memory IC Replacement Considerations

Direct substitutes may include other 64 Mbit SDRAM chips with LVTTL interfaces and similar FBGA footprints. Verify pin compatibility and electrical specifications before swapping. Alternative packages like TSOP may require board redesign. Ensure the replacement supports the same 166 MHz operational frequency.