Memory IC NDS66PBA-16IT TR product image

NDS66PBA-16IT TR

$2.92
  • Description:IC DRAM 64MBIT LVTTL 54FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:0685f1b49598 Category: Brand:

  
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NDS66PBA-16IT TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 64MBIT LVTTL 54FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDS66PBA-16IT TR

  • Description:IC DRAM 64MBIT LVTTL 54FBGA
  • Series:-
  • Mfr:Insignis Technology Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM
  • Memory Size:64Mbit
  • Memory Organization:4M x 16
  • Memory Interface:LVTTL
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:54-TFBGA
  • Supplier Device Package:54-FBGA (8x8)
  • Access Time:5.4 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDS66PBA-16IT TR

NDS66PBA-16IT TR

Memory IC Overview

The NDS66PBA-16IT TR is a SDRAM memory IC manufactured by Insignis Technology Corporation. It features a storage capacity of 64 Mbit organized as 4M x 16. The device operates with an LVTTL interface and supports a clock frequency of 166 MHz, achieving an access time of 5.4 ns. It is housed in a 54-FBGA (8x8) surface-mount package. The component functions within a supply voltage range of 3V to 3.6V and maintains operational reliability across a temperature range of -40°C to 85°C.

Memory IC Feature Summary

  • Utilizes LVTTL interface for standard logic compatibility
  • Supports high-speed data transfer at 166 MHz clock frequency
  • Designed for industrial-grade environmental stability

Memory IC Applications

  • Embedded systems requiring volatile memory storage
  • Industrial control units operating in variable temperatures
  • Consumer electronics utilizing surface-mount assembly

Memory IC Procurement Notes

Verify the specific suffix configuration against official manufacturer documentation to ensure correct packaging and speed grade alignment. Confirm that the 54-FBGA footprint matches the target PCB design constraints. Cross-reference the RoHS compliance status and moisture sensitivity level requirements with current assembly standards before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a compact 64 Mbit SDRAM solution is required for space-constrained designs. The 54-FBGA package offers a small form factor suitable for dense layouts. Ensure the system design accommodates the 3V to 3.6V power supply range and LVTTL signaling levels for proper interface integration.

Memory IC Part Context

This part belongs to the NDS66 series of synchronous dynamic random-access memory devices from Insignis Technology Corporation. The series provides various density options and package configurations tailored for embedded applications. The NDS66PBA-16IT variant specifically addresses needs for moderate-density memory in industrial and commercial electronic equipment.

Memory IC Replacement Considerations

Direct substitutes include other 64 Mbit SDRAM devices in 54-FBGA packages with compatible LVTTL interfaces and similar electrical specifications. Verify pinout compatibility and timing parameters before substitution.

NDS66PBA-16IT TRNDS66PBA-16IT TR
$2.92
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