NDS66PBA-20AT TR

Memory IC Overview

The NDS66PBA-20AT TR is a Synchronous Dynamic Random Access Memory (SDRAM) integrated circuit manufactured by Insignis Technology Corporation. It features a storage capacity of 64 Mbit organized as 4M x 16 bits. The device operates with an LVTTL interface and supports a clock frequency of 200 MHz, achieving an access time of 4.5 ns. It functions within a supply voltage range of 3V to 3.6V and is housed in a 54-FBGA package measuring 8x8 mm. The component is designed for surface mount installation and supports an operating temperature range from -40°C to 85°C.

Memory IC Feature Summary

• Provides high-speed data access via a 200 MHz clock rate and 4.5 ns access time.
• Utilizes Low Voltage TTL (LVTTL) logic levels for standard digital interfacing.
• Operates reliably across extended industrial temperature ranges.

Memory IC Applications

• Embedded memory systems requiring volatile data retention
• Industrial control units operating in variable thermal environments
• Consumer electronics utilizing surface-mount assembly processes

Memory IC Procurement Notes

Verify the specific suffix 'TR' against official manufacturer documentation to confirm tape-and-reel packaging status, as distributor listings may vary. Ensure the part number matches the exact electrical specifications required for your design, particularly the 200 MHz speed grade and FBGA footprint. Cross-reference the RoHS compliance status and moisture sensitivity level (MSL 3) with your manufacturing process requirements before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a compact 64 Mbit SDRAM solution is needed for space-constrained designs. The 54-FBGA package offers a smaller footprint compared to TSOP alternatives. Consider the 3V to 3.6V operating voltage range to ensure compatibility with your system's power rails. Verify that the LVTTL interface aligns with your controller's output standards to prevent signal integrity issues.

Memory IC Part Context

This part belongs to the NDS66P series of SDRAM devices from Insignis Technology Corporation. The series typically includes variants with different capacities and packages, such as the NDS66PT5-20IT which uses a TSOP-II package. The NDS66PBA variant specifically utilizes the Fine-Pitch Ball Grid Array (FBGA) form factor, distinguishing it from other members of the family that may use leaded packages.

Memory IC Replacement Considerations

NDS66PT5-20IT: Offers equivalent electrical performance but utilizes a 54-TSOP II package instead of FBGA. Verify pinout compatibility and mechanical clearance before substitution.