NDS66PBA-20ET TR

Memory IC Overview

The NDS66PBA-20ET TR is a SDRAM memory IC manufactured by Insignis Technology Corporation. It features a storage capacity of 64Mbit organized as 4M x 16. The device operates with an LVTTL interface and supports a clock frequency of 200 MHz, achieving an access time of 5.4 ns. It functions within a supply voltage range of 3V to 3.6V and is housed in a 54-FBGA (8x8) package.

Memory IC Feature Summary

• Utilizes LVTTL interface for standard logic level compatibility
• Provides volatile DRAM storage technology for data retention during power
• Supports high-speed operation at 200 MHz clock frequency

Memory IC Applications

• Embedded systems requiring volatile memory
• Consumer electronics devices
• Industrial control applications

Memory IC Procurement Notes

Verify the specific suffix 'TR' indicates tape and reel packaging configuration when ordering. Confirm the operating temperature range meets environmental requirements. Ensure voltage supply stability within the specified 3V to 3.6V limits. Check RoHS compliance status for regulatory adherence. Validate pinout compatibility with target PCB layout.

Memory IC Selection Notes

Select this component for designs requiring 64Mbit SDRAM with LVTTL signaling. Consider the 54-FBGA package size for space-constrained layouts. Evaluate thermal performance within the -40°C to 85°C operating range. Compare access times against system timing constraints. Assess power consumption relative to other memory options.

Memory IC Part Context

This part belongs to the NDS66 series of SDRAM memories from Insignis Technology Corporation. The series offers various speed grades and package options. The NDS66PBA variant specifically denotes the FBGA package form factor. Other variants include TSOP packages for different board integration needs.

Memory IC Replacement Considerations

Check for direct substitutes within the NDS66 family such as NDS66PBA-16IT or NDS66PT5-16IT. Verify electrical compatibility including voltage and interface standards. Ensure physical footprint matches the existing design constraints.