Memory IC NDS66PBA-20ET product image

NDS66PBA-20ET

$2.10
  • Description:IC DRAM 64MBIT LVTTL 54FBGA
  • Series:NDS66P
  • Mfr:Insignis Technology Corporation
  • Package:Tray

SKU:3e6013c428eb Category: Brand:

  
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NDS66PBA-20ET is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 64MBIT LVTTL 54FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDS66PBA-20ET

  • Description:IC DRAM 64MBIT LVTTL 54FBGA
  • Series:NDS66P
  • Mfr:Insignis Technology Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM
  • Memory Size:64Mbit
  • Memory Organization:4M x 16
  • Memory Interface:LVTTL
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:54-TFBGA
  • Supplier Device Package:54-FBGA (8x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDS66PBA-20ET

NDS66PBA-20ET

Memory IC Overview

The NDS66PBA-20ET is a 64 Mbit SDRAM memory IC manufactured by Insignis Technology Corporation. It features an LVTTL interface and operates at a clock frequency of 200 MHz with a 4.5 ns access time. The device utilizes a 54-TFBGA (8x8) surface-mount package. It supports a supply voltage range of 3V to 3.6V and functions within an operating temperature range of -40°C to 85°C.

Memory IC Feature Summary

  • Provides 64 Mbit volatile storage organized as 4M x 16 using SDRAM technology.
  • Supports high-speed data transfer via a 200 MHz clock frequency.
  • Designed for surface mount installation in a compact 54-FBGA package.

Memory IC Applications

  • Embedded systems requiring volatile memory
  • Consumer electronics devices
  • Industrial control applications

Memory IC Procurement Notes

Verify the specific suffix ET against official Insignis Technology documentation to confirm extended temperature testing requirements. Ensure compatibility with LVTTL signaling levels and 3V to 3.6V power supplies. Confirm the 54-TFBGA footprint matches the target PCB design. Check moisture sensitivity level (MSL 3) handling procedures during assembly.

Memory IC Selection Notes

Select this component when a 64 Mbit capacity with 16-bit width is required for space-constrained designs. The 200 MHz speed suits applications needing moderate bandwidth. Verify that the -40°C to 85°C industrial temperature range meets environmental constraints. Ensure the system provides stable 3V to 3.6V power rails compatible with LVTTL logic levels.

Memory IC Part Context

This part belongs to the NDS66P series of SDRAMs from Insignis Technology. It shares the same core memory architecture and pinout as variants like the NDS66PBA-20IT, differing primarily in testing specifications or packaging details. The series targets embedded markets requiring reliable volatile storage in small form factors.

Memory IC Replacement Considerations

The NDS66PBA-20IT is a related variant within the same family. Verify if the IT suffix implies different testing standards or environmental qualifications compared to the ET version before substitution.

NDS66PBA-20ETNDS66PBA-20ET
$2.10
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