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NDS73PBE-16AT TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 128MBIT LVTTL 90FBGA. Review the specifications below when checking this part for your BOM.
The NDS73PBE-16AT TR is a 128Mbit Synchronous Dynamic Random Access Memory (SDRAM) manufactured by Insignis Technology Corporation. It features a 4M x 32 organization and operates at a clock frequency of 166 MHz with LVTTL interface levels. The device supports a supply voltage range of 3.0V to 3.6V and is housed in a 90-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 8x13 mm. It is rated for an extended industrial temperature range from -40°C to +105°C.
Verify the specific suffix 'TR' indicates Tape and Reel packaging when ordering. Confirm the exact temperature grade matches your environmental requirements, as variants exist. Ensure the 166MHz speed bin is compatible with your system controller's timing specifications. Cross-reference the datasheet for precise pinout and electrical characteristics before finalizing procurement.
Select this component when a 128Mbit capacity with a 32-bit data width is required. The 166MHz speed class suits applications needing moderate bandwidth. Consider the FBGA package size if board real estate is limited. Verify that the host system supports LVTTL signaling levels and can handle the specified power consumption profiles during active and standby modes.
This part belongs to the NDS73P series of SDRAMs from Insignis Technology. It shares architectural similarities with other members like the NDS73PBE-16IT but differs in packaging and temperature ratings. The series targets general-purpose memory needs where cost-effectiveness and standard compatibility are prioritized over specialized low-power or high-performance variants.
Direct substitutes include the NDS73PBE-16IT TR for commercial temperature ranges. Check pin-to-pin compatibility with other 90-FBGA SDRAMs from different manufacturers. Ensure voltage and timing parameters align before swapping components to avoid signal integrity issues.
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