Memory IC NDS73PBE-16AT product image

NDS73PBE-16AT

$3.50
  • Description:IC DRAM 128MBIT LVTTL 90FBGA
  • Series:NDS73P
  • Mfr:Insignis Technology Corporation
  • Package:Tray

SKU:1a914a3d4d1a Category: Brand:

  
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NDS73PBE-16AT is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 128MBIT LVTTL 90FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDS73PBE-16AT

  • Description:IC DRAM 128MBIT LVTTL 90FBGA
  • Series:NDS73P
  • Mfr:Insignis Technology Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM
  • Memory Size:128Mbit
  • Memory Organization:4M x 32
  • Memory Interface:LVTTL
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:90-TFBGA
  • Supplier Device Package:90-FBGA (8x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDS73PBE-16AT

NDS73PBE-16AT

Memory IC Overview

The NDS73PBE-16AT is a 128Mbit (16MB x 8 or 8MB x 16) Single Data Rate (SDR) SDRAM memory integrated circuit manufactured by Insignis Technology Corporation. It operates with a maximum clock frequency of 166 MHz and supports LVTTL logic levels. The device features a 90-ball Fine-Pitch Ball Grid Array (FBGA) package with dimensions of 8x13 mm and a height of 1.2 mm. Electrical specifications include an operating voltage range of 3.0V to 3.6V. The component is available in industrial temperature grades, typically ranging from -40°C to +85°C or -40°C to +105°C depending on the specific suffix variant.

Memory IC Feature Summary

  • Supports Single Data Rate (SDR) data transfer architecture for standard synchronous dynamic random-access memory applications.
  • Utilizes Low Voltage Transistor-Transistor Logic (LVTTL) interface for compatibility with standard digital control systems.
  • Encapsulated in a compact 90-ball FBGA footprint suitable for space-constrained printed circuit board designs.

Memory IC Applications

  • Embedded memory storage in consumer electronic devices requiring volatile data retention.
  • Industrial control systems utilizing LVTTL-compatible microcontrollers.
  • General-purpose computing hardware requiring SDR DRAM solutions.

Memory IC Procurement Notes

Verify the exact temperature grade suffix (e.g., AT vs. IT) against the manufacturer's datasheet, as operational ranges vary between -40°C to +85°C and -40°C to +105°C. Confirm packaging type requirements, noting that some listings specify Tape & Reel while others indicate Tray. Ensure the 90-ball FBGA footprint matches your PCB design constraints before ordering.

Memory IC Selection Notes

Select this component when a 128Mbit SDR capacity is required with LVTTL signaling. The 166 MHz speed rating suits moderate-frequency applications. Consider the specific thermal rating needed for your environment, as the base model number may not explicitly denote the extended industrial temperature range without the correct suffix verification.

Memory IC Part Context

This part belongs to the NDS73P series of SDRAM products from Insignis Technology Corporation. It shares architectural similarities with other variants like the NDS73PBE-20ET but differs in speed grade and potentially temperature rating. The series utilizes parallel interface technology common in legacy and embedded memory systems.

Memory IC Replacement Considerations

Direct substitutes must match the 128Mbit density, 166 MHz speed, LVTTL interface, and 90-ball FBGA package. Verify pinout compatibility and electrical characteristics with alternative SDR SDRAM manufacturers if sourcing from different suppliers.

NDS73PBE-16ATNDS73PBE-16AT
$3.50
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