Memory IC NDS73PBE-16ET product image

NDS73PBE-16ET

$3.01
  • Description:IC DRAM 128MBIT LVTTL 90FBGA
  • Series:NDS73P
  • Mfr:Insignis Technology Corporation
  • Package:Tray

SKU:fb21b677c85f Category: Brand:

  
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NDS73PBE-16ET is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 128MBIT LVTTL 90FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDS73PBE-16ET

  • Description:IC DRAM 128MBIT LVTTL 90FBGA
  • Series:NDS73P
  • Mfr:Insignis Technology Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM
  • Memory Size:128Mbit
  • Memory Organization:4M x 32
  • Memory Interface:LVTTL
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:90-TFBGA
  • Supplier Device Package:90-FBGA (8x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDS73PBE-16ET

NDS73PBE-16ET

Memory IC Overview

The NDS73PBE-16ET is a volatile Synchronous DRAM (SDRAM) memory integrated circuit manufactured by Insignis Technology Corporation. It features a 128Mbit capacity with a 32-bit IO width, organized as 128MB x 32. The device operates at a clock speed of 166 MHz, corresponding to the PC166 standard, and utilizes LVTTL logic levels. It is housed in a 90-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 8x13 mm with a height of 1.2 mm. The component supports an operating temperature range of 0°C to +70°C and draws a current of 3mA.

Memory IC Feature Summary

  • Provides high-speed data access via SDRAM technology with LVTTL interface compatibility
  • Optimized for compact electronic designs through a small footprint FBGA package
  • Supports extended commercial temperature operation ranges

Memory IC Applications

  • Embedded systems requiring volatile memory storage
  • Consumer electronics utilizing SDR SDRAM interfaces
  • Industrial control units operating within commercial temperature limits

Memory IC Procurement Notes

Verify the specific suffix ET against official manufacturer documentation to confirm the exact temperature grade and testing specifications. Ensure that the required voltage levels match the LVTTL interface requirements of the host system. Confirm package dimensions and ball count align with the PCB layout constraints before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a 128Mbit density with a 32-bit data bus is required for SDRAM applications. Consider the 166 MHz operational speed and PC166 timing parameters for system synchronization. Evaluate the physical space constraints due to the 8x13 mm FBGA package size and ensure thermal management strategies accommodate the specified operating temperature range.

Memory IC Part Context

This part belongs to the NDS73 series of synchronous DRAMs from Insignis Technology Corporation. The series includes variants such as the NDS73PBE-16AT and NDS73PBE-16IT, which share similar physical footprints but may differ in temperature ratings or testing standards. The NDS73PBE-16ET specifically denotes the commercial temperature grade variant within this product line.

Memory IC Replacement Considerations

Direct substitutes include the NDS73PBE-16AT and NDS73PBE-16IT from the same manufacturer, provided their respective temperature grades meet application requirements. Cross-manufacturer replacements must match the 128Mbit capacity, 32-bit width, 166 MHz speed, and FBGA package dimensions.

NDS73PBE-16ETNDS73PBE-16ET
$3.01
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