SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
NDS73PBE-16ET is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 128MBIT LVTTL 90FBGA. Review the specifications below when checking this part for your BOM.
The NDS73PBE-16ET is a volatile Synchronous DRAM (SDRAM) memory integrated circuit manufactured by Insignis Technology Corporation. It features a 128Mbit capacity with a 32-bit IO width, organized as 128MB x 32. The device operates at a clock speed of 166 MHz, corresponding to the PC166 standard, and utilizes LVTTL logic levels. It is housed in a 90-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 8x13 mm with a height of 1.2 mm. The component supports an operating temperature range of 0°C to +70°C and draws a current of 3mA.
Verify the specific suffix ET against official manufacturer documentation to confirm the exact temperature grade and testing specifications. Ensure that the required voltage levels match the LVTTL interface requirements of the host system. Confirm package dimensions and ball count align with the PCB layout constraints before finalizing procurement decisions.
Select this component when a 128Mbit density with a 32-bit data bus is required for SDRAM applications. Consider the 166 MHz operational speed and PC166 timing parameters for system synchronization. Evaluate the physical space constraints due to the 8x13 mm FBGA package size and ensure thermal management strategies accommodate the specified operating temperature range.
This part belongs to the NDS73 series of synchronous DRAMs from Insignis Technology Corporation. The series includes variants such as the NDS73PBE-16AT and NDS73PBE-16IT, which share similar physical footprints but may differ in temperature ratings or testing standards. The NDS73PBE-16ET specifically denotes the commercial temperature grade variant within this product line.
Direct substitutes include the NDS73PBE-16AT and NDS73PBE-16IT from the same manufacturer, provided their respective temperature grades meet application requirements. Cross-manufacturer replacements must match the 128Mbit capacity, 32-bit width, 166 MHz speed, and FBGA package dimensions.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.