NDS73PBE-16IT TR

Memory IC Overview

The NDS73PBE-16IT TR is a Synchronous Dynamic Random Access Memory (SDRAM) integrated circuit manufactured by Insignis Technology Corporation. It features a storage capacity of 128Mb, organized as 4M x 32 bits. The device utilizes an LVTTL interface and operates with a clock frequency of 166 MHz. It is housed in a 90-FBGA package measuring 8x13 mm. The component supports a supply voltage range of 3V to 3.6V and functions within a temperature range of -40°C to +85°C.

Memory IC Feature Summary

• Provides high-speed data access via LVTTL interface supporting 166 MHz operation
• Compact surface-mount design utilizing 90-ball FBGA packaging for space-constrained applications
• Operates reliably across extended industrial temperature ranges

Memory IC Applications

• Embedded memory systems requiring volatile data storage
• Industrial control units operating in variable thermal environments
• Consumer electronics utilizing compact form factor constraints

Memory IC Procurement Notes

Verify the specific package variant against project requirements, as the NDS73P series includes both TSOP II and FBGA options. Confirm that the LVTTL logic levels align with the host system's I/O standards. Ensure environmental ratings meet the operational temperature demands of the final assembly. Cross-reference the manufacturer part number with authorized distributors to ensure authenticity and traceability.

Memory IC Selection Notes

Select this component when a 128Mb density with a 32-bit width is required for synchronous memory applications. The choice between TSOP II and FBGA packages depends on board space and soldering capabilities. Verify that the host controller supports the necessary LVTTL signaling and timing parameters for 166 MHz operation. Consider the extended temperature range if the deployment environment exceeds commercial limits.

Memory IC Part Context

This part belongs to the NDS73P family of SDRAM devices from Insignis Technology Corporation. The family offers various densities and interfaces, including LVTTL and LVCMOS options. The NDS73PBE-16IT TR specifically denotes the FBGA package variant, distinguishing it from the TSOP II versions like the NDS73PT9. These components are designed for general-purpose volatile memory needs in embedded systems.

Memory IC Replacement Considerations

Direct substitutes include other NDS73PBE-16IT variants from the same manufacturer. Alternative packages such as the NDS73PT9-16IT offer similar electrical characteristics but differ in physical footprint. Verify pin compatibility and mechanical dimensions before swapping between TSOP II and FBGA formats.