NDS73PBE-20AT TR

Memory IC Overview

The NDS73PBE-20AT TR is a volatile SDRAM memory integrated circuit manufactured by Insignis Technology Corporation. It provides a total memory capacity of 128 Mbit, organized as 4 Megawords by 32 bits. The device operates with an LVTTL interface and supports a clock frequency of up to 200 MHz. It is housed in a 90-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 8x13 mm. The component is designed for industrial temperature ranges, specifically operating between -40°C and +105°C.

Memory IC Feature Summary

• High-speed synchronous dynamic random-access memory technology supporting 200 MHz operation
• Industrial-grade wide temperature range capability from -40°C to +105°C
• Compact 90-ball FBGA packaging for space-constrained applications
• LVTTL compatible interface for standard logic integration

Memory IC Applications

• Embedded systems requiring high-density volatile storage
• Industrial control units operating in extreme temperatures
• Consumer electronics utilizing LVTTL interfaces
• Portable devices needing compact memory solutions

Memory IC Procurement Notes

Verify the specific suffix 'TR' indicates tape and reel packaging when ordering. Confirm the exact temperature grade matches your environmental requirements, as variants exist with different thermal specifications. Ensure the LVTTL voltage levels align with your system's logic standards before finalizing procurement.

Memory IC Selection Notes

Select this component when a 128 Mbit density is required within a small footprint. The 200 MHz speed rating suits applications needing moderate data throughput. Consider the industrial temperature range if the deployment environment exceeds commercial limits. Verify compatibility with existing PCB layouts due to the specific FBGA pinout.

Memory IC Part Context

This part belongs to the NDS73 series of SDRAMs from Insignis Technology. The series includes various density and package options. The NDS73PBE-20ET TR variant shares similar electrical characteristics but may differ in temperature rating or packaging details. The series is designed for general-purpose memory applications in consumer and industrial electronics.

Memory IC Replacement Considerations

Direct substitutes are not explicitly confirmed in public documentation. Equivalent parts must match the 128 Mbit density, 32-bit width, 200 MHz speed, and FBGA package dimensions. Verify pin-to-pin compatibility and voltage levels before substitution.