Memory IC NDS73PBE-20IT product image

NDS73PBE-20IT

$3.32
  • Description:IC DRAM 128MBIT LVTTL 90FBGA
  • Series:NDS73P
  • Mfr:Insignis Technology Corporation
  • Package:Tray

SKU:57b8ddde6dec Category: Brand:

  
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NDS73PBE-20IT is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC DRAM 128MBIT LVTTL 90FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for NDS73PBE-20IT

  • Description:IC DRAM 128MBIT LVTTL 90FBGA
  • Series:NDS73P
  • Mfr:Insignis Technology Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM
  • Memory Size:128Mbit
  • Memory Organization:4M x 32
  • Memory Interface:LVTTL
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:90-TFBGA
  • Supplier Device Package:90-FBGA (8x13)
  • Access Time:5 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for NDS73PBE-20IT

NDS73PBE-20IT

Memory IC Overview

The NDS73PBE-20IT is a 128 Mbit SDRAM memory IC manufactured by Insignis Technology Corporation. It features an LVTTL interface and operates at a clock frequency of 200 MHz with a 5 ns access time. The device is organized as 4M x 32 bits and supports a supply voltage range of 3V to 3.6V. It is housed in a 90-FBGA package measuring 8x13 mm with a height of 1.2 mm. The component is rated for an industrial operating temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • High-speed synchronous dynamic random-access memory architecture supporting 200 MHz operation
  • LVTTL interface compatibility for standard logic integration
  • Industrial-grade thermal stability across extended temperature ranges

Memory IC Applications

  • Embedded systems requiring high-density volatile memory
  • Industrial control units operating in extreme temperatures
  • Consumer electronics utilizing LVTTL signaling standards

Memory IC Procurement Notes

Verify the specific package variant, as the FBGA footprint differs from TSOP options within the same family. Confirm that the 200 MHz speed grade matches system timing requirements. Ensure the LVTTL interface aligns with host controller voltage levels. Check RoHS compliance status for regulatory adherence. Validate availability through authorized channels due to potential supply constraints.

Memory IC Selection Notes

Select this part when 128 Mbit density and 200 MHz performance are required in a compact BGA form factor. Compare against NDS73PT9-16IT if TSOP packaging or lower speeds suffice. Ensure the host system supports LVTTL signaling without level shifting. Consider the 90-ball BGA layout for PCB routing complexity. Verify power supply stability within the 3V to 3.6V window for reliable operation.

Memory IC Part Context

This component belongs to the NDS73 series of SDRAM devices from Insignis Technology Corporation. The series includes variants with different packages such as TSOP II and BGA, and varying clock speeds like 166 MHz. The NDS73PBE-20IT specifically denotes the BGA package with 200 MHz capability. It shares the core 128 Mbit organization with other members but offers distinct physical and electrical characteristics.

Memory IC Replacement Considerations

NDS73PT9-16IT TR is a documented alternative within the same product line, offering 128 Mbit capacity in an 86-TSOP II package with 166 MHz speed. Verify pinout compatibility and interface voltage levels before substitution.

NDS73PBE-20ITNDS73PBE-20IT
$3.32
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