NE57814DD,518

NE57814DD,518

  • Description:IC DDR TERM W/STANDBY 8-SOIC
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:fd38319cfd97 Category: Brand:

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Product Detailed Parameters

  • Description:IC DDR TERM W/STANDBY 8-SOIC
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Applications:Memory, DDR/DDR2 Regulator
  • Current - Supply:14mA
  • Voltage - Supply:1.6V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width) Exposed Pad
  • Supplier Device Package:8-HSO
  • Grade:-
  • Qualification:-

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NE57814DD,518

Overview

The NE57814DD,518 is a specialized Power Management IC designed by NXP USA Inc. for DDR memory bus termination. It operates within a supply voltage range of 1.6 V to 3.6 V and draws a supply current of 14 mA. The device functions at an operating temperature between 0°C and 70°C. Packaged in an 8-SOIC (0.154", 3.90mm Width) with an exposed pad, it integrates standby capabilities to reduce board space and system cost while meeting EU environmental standards including ROHS and REACH.

Feature Summary

  • Provides dedicated power for DDR memory bus termination
  • Integrates standby functionality to minimize component count
  • Reduces overall board space and system manufacturing costs

Applications

  • DDR memory bus termination
  • DDR2 memory regulator systems

Procurement Notes

Verify the part status carefully as some sources indicate this specific variant may be obsolete. Confirm the exact suffix requirements for your bill of materials against current NXP production lists. Ensure compatibility with existing PCB footprints for the 8-SOIC package before finalizing procurement orders.

Selection Notes

Select this component when designing systems requiring integrated DDR/DDR2 termination regulators. It is suitable for applications needing reduced parts count and simplified power management for memory interfaces. Consider the 8-SOIC package constraints and thermal dissipation requirements associated with the exposed pad design.

Part Context

This component belongs to the PMIC - Power Management Specialized subcategory. It is manufactured by NXP USA Inc. and falls under the broader class of integrated circuits used for power management in electronic devices. The device is specifically engineered to support memory subsystems.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify cross-references through official NXP channels or authorized distributors if alternative sourcing is required.

NE57814DD,518NE57814DD,518

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