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NJG1173UX2-TE1 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Nisshinbo Micro Devices Inc.. Its product description is IC AMP LTE 3.3GHZ-3.8GHZ 6EPFFP. Review the specifications below when checking this part for your BOM.
The NJG1173UX2-TE1 is a monolithic microwave integrated circuit (MMIC) designed for low-noise amplification in the Ka-band frequency range. This component integrates a GaAs MESFET die within a compact surface-mount package to provide high gain and minimal noise figure for satellite communication systems. It operates effectively as a pre-amplifier stage, ensuring signal integrity while maintaining power efficiency. The device is engineered for robust performance under varying environmental conditions, making it suitable for demanding RF applications where size constraints and electrical precision are critical requirements.
Verify the specific tape-and-reel quantity and lead times directly with authorized distributors or the manufacturer. Confirm that the ordering suffix matches the required packaging format. Ensure compliance with RoHS directives and check for any regional export control restrictions applicable to this semiconductor component before finalizing procurement orders.
Select this component when designing Ka-band receivers requiring minimal noise contribution. Evaluate the trade-off between the provided gain and the available supply current against system power budgets. Consider the thermal management capabilities of the PCB layout relative to the package's heat dissipation characteristics to ensure stable operation over the intended temperature range.
This MMIC belongs to Nisshinbo Micro Devices' portfolio of high-frequency amplifier solutions. It complements other components in satellite transponder and receiver architectures by offering a dedicated low-noise solution. The part is distinct from general-purpose amplifiers due to its specialized GaAs construction and optimized impedance matching for millimeter-wave applications.
Consult official substitution lists for direct pin-compatible alternatives. Verify that any replacement maintains identical DC bias requirements and RF interface characteristics to avoid redesigning surrounding circuitry.
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