NJU7076F-TE1

Overview

The NJU7076F-TE1 is a precision operational amplifier from Nisshinbo Micro Devices, designed for low-noise applications. It features an input offset voltage of 150 µV and operates within a supply voltage range of -0.3 V to +7 V. The device utilizes a compact SOT-23-5 package (SC-74A) suitable for surface-mount assembly. It belongs to the NJU7076 series of precision amplifiers, offering high accuracy for signal conditioning tasks in portable and battery-powered equipment.

Feature Summary

• Precision performance with low input offset voltage
• Low noise characteristics for sensitive signal processing
• Wide single-supply operation capability

Applications

• Portable medical instrumentation
• Battery-powered sensor interfaces
• High-accuracy data acquisition systems

Procurement Notes

Verify the specific suffix TE1 indicates reel packaging when ordering. Confirm RoHS compliance status through official documentation prior to integration. Ensure the supplier provides valid traceability records. Check current availability as stock levels fluctuate. Validate that the component matches the exact manufacturer part number for design compatibility.

Selection Notes

Select this component when low noise and precision are critical requirements. Consider the 150 µV offset voltage for DC accuracy needs. Evaluate the 7 V maximum supply limit against system power rails. Compare against other NJU7076 variants if different pinouts or packages are required. Ensure the SOT-23-5 footprint fits the PCB layout constraints.

Part Context

This part belongs to the NJU7076 series of precision amplifiers manufactured by Nisshinbo Micro Devices. The series focuses on low-noise and high-accuracy specifications for analog signal processing. The F-TE1 designation specifies the tape-and-reel packaging format for automated assembly. It complements other general-purpose and low-power op-amps in the company's portfolio.

Replacement Considerations

Consult official substitution guides for direct replacements. Verify pinout compatibility before swapping components. Check electrical parameter overlaps to ensure functional equivalence. Review package dimensions for mechanical fit. Confirm thermal characteristics match the application environment.