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Product Detailed Parameters
- Description：IC SW SPDTX2 3.5OHM 10MICROBUMP
- Series：-
- Mfr：onsemi
- Package：Tape & Reel (TR),Tape & Reel (TR),Bulk
- Switch Circuit：SPDT
- Multiplexer/Demultiplexer Circuit：2:01
- On-State Resistance (Max)：3.5Ohm
- Channel-to-Channel Matching (ΔRon)：100mOhm
- Voltage - Supply, Single (V+)：1.8V ~ 5.5V
- Voltage - Supply, Dual (V±)：-
- Switch Time (Ton, Toff) (Max)：30ns, 40ns
- -3db Bandwidth：40MHz
- Charge Injection：9pC
- Channel Capacitance (CS(off), CD(off))：30pF
- Current - Leakage (IS(off)) (Max)：1nA
- Crosstalk：-110dB @ 1MHz
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：10-UFBGA, FCBGA
- Supplier Device Package：10-Microbump
- Number of Circuits：2
- Grade：-
- Qualification：-
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Overview
The NLAS4717FCT1G is a dual independent Single Pole Double Throw (SPDT) analog switch fabricated in sub-micron silicon gate CMOS technology. It features two low RDS(on) channels of 4.5 Ω at 3.0 V and guaranteed Break-Before-Make switching to prevent driver shorting. The device operates over a wide voltage range from 1.8 V to 5.5 V with high bandwidth exceeding 40 MHz. Key electrical parameters include ultra-low charge injection of ≤ 6.0 pC, low standby current of 1.0 nA maximum at 25°C, and overvoltage tolerance on control pins. It is available in the Flip-Chip-10 package.
Feature Summary
- Dual independent SPDT configuration with guaranteed Break-Before-Make switching
- Ultra-low charge injection for signal integrity preservation
- Overvoltage tolerance on logic control pins
- High bandwidth operation suitable for RF applications
Applications
- Cell phones
- PDAs
- MP3 players
- Digital still cameras
Procurement Notes
Verify the specific ordering suffix FCT1G confirms the Flip-Chip-10 package and tape & reel shipping quantity of 3000 units. Ensure the 'G' suffix indicates Pb-Free compliance as specified in the manufacturer's documentation. Confirm that the component meets RoHS standards before finalizing procurement orders.
Selection Notes
Select this component when dual SPDT switching is required within portable devices operating between 1.8 V and 5.5 V. The Flip-Chip-10 package offers a compact footprint ideal for space-constrained designs. Consider the 4.5 Ω on-resistance and >40 MHz bandwidth for high-frequency signal routing requirements.
Part Context
This part belongs to the NLAS4717 family of advanced CMOS analog switches. It is pin-to-pin compatible with the MAX4717, facilitating direct replacement in existing designs. The series includes variants such as the Micro10 package version, providing flexibility in form factor selection while maintaining identical electrical performance characteristics.
Replacement Considerations
The NLAS4717FCT1G is explicitly documented as pin-to-pin compatible with the MAX4717. Verify that the alternative component matches the Flip-Chip-10 package dimensions and electrical specifications before implementation.
