NLQ26PFS-6NET

Memory IC Overview

The NLQ26PFS-6NET is a mobile LPDDR4 SDRAM memory IC manufactured by Insignis Technology Corporation. It provides a total storage capacity of 2Gbit, organized as 128M x 16. The component operates with a clock frequency of 1.6 GHz and features a typical access time of 3.5 ns. It utilizes Low Voltage Single Data Rate (LVSTL) signaling standards suitable for power-efficient applications. The device is housed in a 200-ball Fine-Pitch Ball Grid Array (FBGA) package with dimensions of 10x14.5 mm.

Memory IC Feature Summary

• Mobile LPDDR4 synchronous DRAM technology
• Low voltage single data rate signaling
• High-speed 1.6 GHz operation capability

Memory IC Applications

• Mobile computing devices
• Smartphones and tablets
• Portable electronic systems requiring low-power memory

Memory IC Procurement Notes

Verify the specific datasheet version and manufacturing lot details when sourcing this component. Confirm that the FBGA package dimensions and ball layout match your PCB design requirements. Ensure compatibility with the target system's memory controller specifications regarding timing and voltage levels before integration.

Memory IC Selection Notes

Select this part for designs requiring 2Gbit LPDDR4 capacity in a compact form factor. The 1.6 GHz speed rating supports high-bandwidth mobile applications. Consider the 200-ball FBGA footprint during layout planning to ensure adequate clearance and thermal management for the 10x14.5 mm package size.

Memory IC Part Context

This component belongs to the LPDDR4 family of synchronous dynamic random-access memory. It is designed specifically for mobile and portable electronics where power efficiency and small physical footprint are critical constraints. The 2Gbit density offers a balance between storage needs and cost for mid-range mobile devices.

Memory IC Replacement Considerations

Check for direct substitutes within the same LPDDR4 generation with identical pinouts and electrical characteristics. Verify if alternative vendors offer compatible 2Gbit x16 configurations in 200-ball FBGA packages.