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NLXA3PFS-4NET is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is LPDDR4X 16GB X32 4266MBPS/PIN 10. Review the specifications below when checking this part for your BOM.
Memory IC specifications for NLXA3PFS-4NET
- Description：LPDDR4X 16GB X32 4266MBPS/PIN 10
- Series：-
- Mfr：Insignis Technology Corporation
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR4X
- Memory Size：16Gbit
- Memory Organization：512M x 32
- Memory Interface：LVSTL
- Clock Frequency：2.133 GHz
- Write Cycle Time - Word, Page：18ns
- Voltage - Supply：1.06V ~ 1.17V, 1.7V ~ 1.95V
- Operating Temperature：-25°C ~ 85°C (TC)
- Mounting Type：Surface Mount
- Package / Case：200-WFBGA
- Supplier Device Package：200-FBGA (10x14.5)
- Access Time：3.5 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for NLXA3PFS-4NET
Memory IC Overview
The NLXA3PFS-4NET is a 16 Gbit LPDDR4X DRAM manufactured by Insignis Technology Corporation. It features a x32 organization and supports data rates up to 4266 Mbps per pin. The component utilizes an FBGA package with dimensions of 10x14.5 mm and a height of 0.8 mm. Designed for industrial and extended test applications, it ensures robust performance in demanding environments.
Memory IC Feature Summary
- LPDDR4X technology for high-speed data transfer
- Extended test flow process for reliability
- Industrial temperature range operation capability
Memory IC Applications
- Industrial IoT systems
- Autonomous transportation embedded applications
- Driver information systems
Memory IC Procurement Notes
Verify the specific package variant and speed grade against the official datasheet before procurement. Confirm that the extended test flow requirements align with your quality assurance standards. Ensure compatibility with the host controller's LPDDR4X interface specifications. Check for any specific automotive or industrial qualification certifications required for your deployment environment.
Memory IC Selection Notes
Select this component when high-density memory with fast data rates is required for industrial or transportation applications. Consider the FBGA package size constraints during PCB layout. Evaluate the need for extended testing protocols if operating in harsh environmental conditions. Compare power consumption characteristics against other LPDDR4X options for system efficiency.
Memory IC Part Context
Insignis Technology Corporation specializes in fabless DRAM design focusing on supply stability and long-term support. Unlike major volume manufacturers, they prioritize robustness for emerging industrial and autonomous sectors. This part represents their commitment to providing reliable memory solutions without frequent die shrinks or re-qualification risks.
Memory IC Replacement Considerations
No direct public substitute part numbers are confirmed for this specific model. Verify compatibility with existing board designs if considering alternative vendors. Ensure any replacement maintains the same LPDDR4X protocol and physical footprint.
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