NRVHP820MFDWFT3G

Overview

The NRVHP820MFDWFT3G is a discontinuous ultrafast rectifier in the DFN8 dual flag SO-8 flat lead package. It contains two electrically independent diodes rated for 200 V reverse voltage and 4 A average forward current per device. The component supports an operating junction temperature up to 175°C and features low thermal resistance via an exposed pad design.

Feature Summary

• Dual flag package enables versatile board-level configurations including common cathode, common anode, or series connections.
• Exposed pad construction provides efficient die-to-board area ratio and low thermal resistance comparable to DPAK packages.
• Automotive qualification includes AEC-Q101 certification and PPAP capability for unique site and control change requirements.

Applications

• Output rectification in switching power supplies
• Freewheeling diode applications with inductive loads
• Space-constrained automotive electronics

Procurement Notes

This specific part number is officially discontinued and not recommended for new designs. Verification of availability requires direct contact with onsemi representatives. Alternative sourcing should focus on current product lines as this item is no longer supported for production.

Selection Notes

Designers must account for the discontinuation status when selecting this component. The dual-flag configuration allows flexible circuit topologies but requires careful layout consideration for thermal management. Verify that the 200V rating and 4A current capacity meet system requirements before considering obsolete alternatives.

Part Context

This device belongs to the HP820MFD family of ultrafast rectifiers manufactured by onsemi. It utilizes the DFN8 5x6 package (CASE 506BT) which offers a smaller footprint than traditional DPAK packages while maintaining similar thermal performance characteristics for high-efficiency power conversion applications.

Replacement Considerations

N/A

FAQ

What are the electrical connection options for the internal diodes?

The two devices are electrically independent and can be used separately, as common cathode, as common anode, or in series depending on the board level layout.

What is the maximum operating junction temperature?

The device supports an operating junction temperature range from -55°C to +175°C.

How does the package compare to DPAK in terms of size?

While thermal performance is nearly identical to the DPAK package, the height and board footprint of the DFN8 dual flag package are less than half.