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NSEC53T016-IT is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC FLASH 128GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.
The NSEC53T016-IT is a 128Gbit (16GB) eMMC 5.1 NAND flash memory IC utilizing advanced 15nm 3D TLC technology. It features a 153-FBGA package measuring 11.5x13 mm and operates at a clock frequency of 200 MHz. The device supports VCC=3.3V and dual-voltage VCCQ options of 1.8V or 3.3V. Designed for industrial applications, it maintains an operating temperature range of -40°C to +85°C.
Verify the specific voltage configuration required by your design, as the component supports both 1.8V and 3.3V VCCQ levels. Confirm that the 153-FBGA footprint matches your PCB layout constraints. Ensure the selected variant meets the industrial temperature rating of -40°C to +85°C if deployed in harsh environments. Cross-reference the datasheet for precise pinout definitions before finalizing procurement.
Select this component when a high-density, non-volatile storage solution with robust error correction is required for industrial-grade applications. The 3D TLC architecture offers a balance between capacity and cost-effectiveness compared to SLC alternatives. Consider the 200 MHz interface speed for bandwidth requirements. Verify compatibility with host controllers supporting eMMC 5.1 standards and ensure power supply rails align with the specified VCC and VCCQ ranges.
This part belongs to the Insignis Technology Corporation NSEC series of embedded multimedia card solutions. It represents a shift toward higher density storage using 3D NAND structures within standard FBGA packages. The series targets markets demanding reliable, compact memory modules capable of withstanding rigorous operational conditions while maintaining data consistency through internal management functions.
Check for NSEC53T016-ITJ as a potential variant with similar specifications but potentially different suffix implications. Verify pin-to-pin compatibility and electrical characteristics before substitution. Ensure any replacement maintains the same eMMC version and package dimensions.
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