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NSEC53T032-AT is listed in the Memory IC range at ChipApex. The manufacturer field lists Insignis Technology Corporation. Its product description is IC FLASH 256GBIT EMMC 153FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for NSEC53T032-AT
- Description：IC FLASH 256GBIT EMMC 153FBGA
- Series：NSEC
- Mfr：Insignis Technology Corporation
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (TLC)
- Memory Size：256Gbit
- Memory Organization：32G x 8
- Memory Interface：eMMC_5.1
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-VFBGA
- Supplier Device Package：153-FBGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for NSEC53T032-AT
Memory IC Overview
The NSEC53T032-AT is a 32GB NAND flash memory IC utilizing TLC technology and eMMC 5.1 interface. It operates at 200 MHz with VCC=3.3V and VCCQ=1.8V/3.3V. The component is housed in a 153-FBGA package (11.5x13 mm). It supports pSLC mode for enhanced reliability. Operating temperature range is -40°C to 85°C, classifying it as an industrial-grade device.
Memory IC Feature Summary
- Supports pSLC mode for improved data retention and endurance
- Complies with eMMC 5.1 standard for high-speed data transfer
- Industrial temperature rating ensures stable operation in harsh environments
Memory IC Applications
- Industrial control systems
- Automotive infotainment units
- Consumer electronics storage
Memory IC Procurement Notes
Verify the specific suffix AT against official Insignis Technology Corporation documentation to confirm exact electrical characteristics and package dimensions. Ensure compatibility with host controller voltage levels (VCC/VCCQ) before integration. Cross-reference datasheet revisions to validate current production status and availability constraints.
Memory IC Selection Notes
Select this model when industrial temperature stability (-40°C to 85°C) is required alongside high-density storage. The pSLC mode option provides necessary endurance for write-intensive applications compared to standard TLC operations. Confirm FBGA-153 footprint compatibility with PCB design constraints.
Memory IC Part Context
This part belongs to the NSEC series of NAND flash memories from Insignis Technology Corporation. It utilizes 3D TLC architecture to achieve high capacity within a compact form factor. The series targets embedded multimedia and industrial applications requiring reliable non-volatile storage solutions.
Memory IC Replacement Considerations
NSEC53T032-ITJ serves as a comparable variant within the same product family, sharing similar density and package specifications. Verify functional equivalence regarding interface protocols and operating voltages before substitution.
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